# Solving Power Cycling and Connectivity Failures: PCB Surface Finish Voiding Case Study

> These excerpts of Covalent Academy's webinar on porous materials characterization introduce 3 of the most common techniques in this field.

Source: https://covalent.com/resource-library/solving-power-cycling-and-connectivity-failures-pcb-surface-finish-voiding-case-study/
Updated: 2026-05-12T22:25:21+00:00

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# Solving Power Cycling and Connectivity Failures: PCB Surface Finish Voiding Case Study

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October 10, 2025

In this case study, Jessica Batterman, Failure Analysis Engineer at Covalent, investigates a client’s recurring issues with unexpected power cycling and intermittent connectivity in PCB components. This analysis uncovers surface voiding in PCB assemblies as the root cause. Using advanced microscopy and cross-sectional techniques, Jessica demonstrates how these microstructural defects led to compromised electrical performance. This case highlights the value of expert [failure analysis](https://covalent.com/solutions/failure-analysis/) in resolving complex reliability challenges in modern electronics.

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