# 2D X-Ray Inspection > Delivers clear internal views of complex electronics. Source: https://covalent.com/techniques/morphology-structural-analysis/2d-x-ray-inspection/ Updated: 2026-04-27T23:40:28+00:00 --- ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/themes/covalent/assets/images/blog-default-banner.jpg) ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/themes/covalent/assets/images/blog-mobile-banner.jpg) [Core Lab](https://covalent.com/covalent-core-lab/) # 2D X-Ray Inspection 2D X-ray inspection delivers clear internal views of complex electronics, supporting faster decisions in production and failure analysis. [Add to Quote](#) ## What Is a 2D X-Ray? 2D X-ray inspection is a non-destructive failure analysis method that captures hidden faults in the PCBs and BGA solder joints. Key benefit: It offers rapid defect detection in PCB X-ray inspection and BGA X-ray inspection, catching hidden failures such as voids, cracks, or Head in Pillow defects without destructive [cross-sectioning](/techniques/mechanical-testing/mechanical-cross-section-analysis-x-section/). Fast and Non-destructive ### Fast and Non-destructive Quickly identifies hidden defects and Head-in-Pillow failures without cutting or damaging samples. High Clarity ### High Clarity Reveals fine issues in multilayer PCBs and BGAs, providing detailed defect localization for [quality assurance](/solutions/quality-control-qc-testing/). Efficient Inspection ### Efficient Inspection Ideal for routine PCB and BGA inspections in production environments. ## Why Use 2D X-Ray Imaging? 2D X-ray inspection is a fast, non-destructive approach that adds depth perception for exposing hidden defects in modern electronics. It delivers high-resolution insights into solder voids, cracks, and interconnect failures. It supports high-throughput PCBA inspection services without damaging or altering fragile assemblies. It is well-suited for multilayer PCBs, BGAs, and high-density packaging. ### Improved Defect Visibility Pinpoint and quantify crystalline phases to confirm purity, detect impurities, and verify processing outcomes. ### High-Magnification and Resolution Captures micron-level features with up to 68,000× total magnification for precise analysis. ### Flexible Energy Range Operates from 30–160 kV and accommodates samples up to 740 × 580 mm, supporting diverse materials and assemblies. ## Covalent’s Capabilities Offer 2D X‑Ray Inspection for Non‑Destructive Internal Defect Detection [Get a Quote](https://covalent.com/get-a-quote/) ## Working Principle - An X-ray source projects radiation through the sample at multiple tilt angles. - By tilting or rotating the sample, the system captures angled projections that reduce feature overlap and reveal clearer details of hidden structures. - Denser regions absorb more radiation (appearing darker), while lighter regions allow greater transmission. - Highly effective for PCB X-ray inspection and BGA X-ray inspection, where hidden solder or interconnect defects can be resolved. ### Equipment Used for 2D X-Ray Inspection: #### Nordson Dage Quadra 7 - Energy output: up to 160 kV. - 100 nm feature recognition. - 7 MP flat panel digital detector. - 30 fps framerate. - 0–70° oblique angle view. - Inspection area: 20 × 17.5 in. - Geometric magnification: UP TO 2.5 kx. - Total magnification: up to 68,000x. - Dosage control for X-ray sensitive samples. - High Dynamic Range (HDR) enhancement software. ### Key Differentiators - **Analytical Depth:** - Captures 2D radiographs with contrast from material density and thickness variations, enabling detection of hidden voids, cracks, and misalignments without destructive cross-sectioning. - **Detection Limits:** - 30–250kV energy range (in-house). - Up to 250kV with partners. - Resolution suitable for micro-voids and interconnect failures in BGA X-ray assemblies. - **Material Compatibility:** - [Metals](/applications/metals-testing-and-failure-analysis-lab/), ceramics, polymers, composites. - Specialized for PCBA inspection services and multilayer boards. - **Sample Size and Weight:** - Up to ~740 × 580 mm and 5 kg. - Effective area: ~510 × 445 mm. #### Strengths - Rapid throughput for PCB X-ray inspection. - Flexible dosage allows safe imaging of sensitive devices. #### Limitations - Projection-Only Imaging: Produces flat radiographs, limiting depth analysis compared to [Micro-CT scanning](/techniques/morphology-structural-analysis/micro-x-ray-computed-tomography-micro-ct/). - Penetration Limits: Very dense or thick samples can reduce image clarity, introduce artifacts, or obscure fine details. Two colleagues working together on a laptop, discussing a project in a bright, professional environment. ## Unsure Whether 2D X-Ray Inspection Is Right for You? Learn how 2D X-ray inspection can reveal hidden defects in PCBs and BGAs, helping you make faster, more confident electronics decisions. [Talk to an Expert](https://covalent.com/contact-us/) ## Sample Information Example Outputs Sample Requirements [https://covalent.com/wp-content/uploads/2026/01/2D-X-ray-radiography_cell-phone-output.jpg](https://covalent.com/wp-content/uploads/2026/01/2D-X-ray-radiography_cell-phone-output.jpg) 2D X-ray Radiograph of a conventional smartphone, illuminating the interior features and components without disassembly or destructive testing. [https://covalent.com/wp-content/uploads/2026/01/2D-X-Ray-imaging-output.jpg](https://covalent.com/wp-content/uploads/2026/01/2D-X-Ray-imaging-output.jpg) 2D X-ray Radiograph of a smartphone camera. [https://covalent.com/wp-content/uploads/2026/01/2D-X-Ray-wire-bonded-component-output.jpg](https://covalent.com/wp-content/uploads/2026/01/2D-X-Ray-wire-bonded-component-output.jpg) X-ray Radiograph of a still-packaged wire-bonded component. The Lead frame, bond wires, and die are clearly visible. [https://covalent.com/wp-content/uploads/2026/01/2D-X-ray-BGA-board-and-device.jpg](https://covalent.com/wp-content/uploads/2026/01/2D-X-ray-BGA-board-and-device.jpg) Left: X-ray Radiograph of an unbonded BGA board. Right: Oblique view of a wire-bonded device and BGA soldered on opposite sides of a PCB. Copper traces, vias, solder balls, and solder voids are clearly visible. ### What we accept: - Requires solid samples or samples that can be glued in place to limit vibrations. - Samples need to be stable under normal atmospheric conditions. - Samples need to be a maximum size of 740 x 580 mm (29 x 22.8 inches). - Samples are limited to a maximum weight of 5 kg (11lbs). - The inspection area can be up to 510 x 445mm. ## Use Cases - Electronics & Semiconductor - Battery & Energy Storage - Medical Devices & Biomedical - General Materials Science - PCBA Inspection Services - ![Semiconductor](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/11/uc-semiconductor.jpg) ### Electronics & Semiconductor Detects solder voids, cracked balls, bridging, lifted wires, and Head in Pillow defects in BGA. - ![Battery & Energy Storage](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/11/uc-energy-storage.jpg) ### Battery & Energy Storage Reveals voids, cracks, or delamination in electrodes and seals. - ![Medical Devices and Biomedical](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/11/uc-medical-devices.jpg) ### Medical Devices & Biomedical Ensures proper assembly of miniature implantable devices. - ![General Materials Science](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/11/Material-science.jpg) ### General Materials Science Identifies inclusions, porosity, and fractures in composites and metals. - ![PCBA Inspection Services](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/12/uc-PCBA-inspection-services.jpg) ### PCBA Inspection Services Identify via misalignment, shorts, and layer defects in complex boards. ## Complementary Techniques - **[Mechanical Cross-Section](https://covalent.com/techniques/mechanical-testing/mechanical-cross-section-analysis-x-section/):** To expose potential defects and understand their origin. - **[Micro-CT](https://covalent.com/techniques/morphology-structural-analysis/micro-x-ray-computed-tomography-micro-ct/):** Provides a complete 3D reconstruction of the sample for a more detailed internal analysis. - **Optical Microscopy:** Ideal for surface-level inspections, where penetrative scanning is unnecessary. - **[Scanning Electron Microscopy](https://covalent.com/techniques/electron-microscopy/scanning-electron-microscopy-sem/):** Provides high-resolution surface and cross-sectional imaging. [Mechanical Cross-Section Analysis (X-Section)](https://covalent.com/techniques/mechanical-testing/mechanical-cross-section-analysis-x-section/) Uncovers microstructures and defects causing performance issues. [Explore](https://covalent.com/techniques/mechanical-testing/mechanical-cross-section-analysis-x-section/) [Add to Quote](#) [Scanning Electron Microscopy (SEM) Analysis](https://covalent.com/techniques/electron-microscopy/scanning-electron-microscopy-sem/) Images surface topography and composition with electrons. [Explore](https://covalent.com/techniques/electron-microscopy/scanning-electron-microscopy-sem/) [Add to Quote](#) [X-ray Computed Tomography (Micro-CT)](https://covalent.com/techniques/morphology-structural-analysis/micro-x-ray-computed-tomography-micro-ct/) Non-contact, non-destructive 2D/3D images at micron scale. [Explore](https://covalent.com/techniques/morphology-structural-analysis/micro-x-ray-computed-tomography-micro-ct/) [Add to Quote](#) ## Why Choose Covalent for Your 2D X-Ray Imaging Needs? Covalent offers industry-leading expertise in 2D X-ray inspection, delivering rapid results for PCB and BGA X-ray inspections. Our team tailors X-ray metrology conditions for each project, ensuring reliable detection of solder voids, interconnect failures, and subtle assembly defects. Whether you need fast PCBA inspection services or in-depth non-destructive failure analysis, our solutions provide clarity and actionable insight. ## Frequently Asked Questions Identifying the right test can be complex, but it doesn’t have to be complicated. Here are some questions we are frequently asked. - ### What is the difference between 2D, 2.5D, and 3D X-ray inspection? - 2D X-ray (radiography): Produces flat projection images, ideal for fast PCB X-ray inspection but limited by feature overlap. - 2.5D X-ray inspection: Collects angled projections through oblique-view geometry to create depth-resolved images, reducing feature overlap and improving defect detection in BGA X-ray inspection and multilayer PCBs. - 3D CT: Reconstructs a full volumetric model, providing the most complete data but with longer scan times. - ### Can a 2D X-ray detect solder voids and BGA connectivity issues? Yes. 2D X-ray inspection reveals solder voids, poor wetting, and interconnect failures in BGAs. While CT provides more precise volumetric void measurements, 2D imaging delivers rapid and reliable screening for quality control. - ### How does 2D X-ray inspection compare in speed and accuracy to 3D CT? - Speed: 2D X-ray imaging is faster, ideal for PCBA inspection services and high-throughput testing. - Accuracy: It provides clearer in-plane detail than 2D radiography, but CT is more accurate for a complete volumetric analysis. - ### What spatial resolution and feature sizes can 2D X-ray resolve? Modern 2D X-ray inspection systems can resolve features in the low-micron range, making them ideal for analyzing solder joints, cracks, and interconnects in PCB X-ray inspection and BGA X-ray inspection, as well as batteries, metal parts, medical devices, and more. - ### What sample size or geometry limits apply to 2D X-ray inspection? Typical systems can handle boards up to ~740 × 580 mm and weights up to 5 kg. Very dense or thick samples may require CT instead of oblique X-ray metrology. - ### When should I choose 2D or 2.5D X-rays over a 3D Scan? Choose 2D X-ray inspection when a full 3D CT scan is unnecessary or time-consuming. It is ideal for multilayer PCB X-ray inspection and BGA X-ray inspection, providing depth-resolved images that reveal hidden solder voids, cracks, and Head in Pillow defects without destructive cross-sectioning. Resources ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/themes/covalent/assets/images/resource-bg-c.svg) Resources ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/themes/covalent/assets/images/resource-bg-o.svg) [![Unveiling the Nanoscale: PiFM for Chemical, Structural, and Surface Characterization](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/10/Unveiling-the-Nanoscale-768x430.webp) Webinar Unveiling the Nanoscale: PiFM for Chemical, Structural, and Surface Characterization 53 mins Oct 16, 2025](https://covalent.com/webinars/unveiling-the-nanoscale-pifm-for-chemical-structural-and-surface-characterization/) [![Adventures in Wavelength Dispersive X-Ray Fluorescence (WDXRF): Flexible Element Analysis for Thin Films and More](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/09/Ep29-WDXRF-with-Rigaku_V2_Zoom-768x768.png) Webinar Adventures in Wavelength Dispersive X-Ray Fluorescence (WDXRF): Flexible Element Analysis for Thin Films and More 60 mins Jan 27, 2022](https://covalent.com/webinars/adventures-in-wavelength-dispersive-x-ray-fluorescence-wdxrf-flexible-element-analysis-for-thin-films-and-more/) [![(Thin Film) Reflections on X-Ray Reflectometry](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/09/Ep12_XRR-v5-225x225-1.png) Webinar (Thin Film) Reflections on X-Ray Reflectometry 60 mins Jul 09, 2020](https://covalent.com/webinars/thin-film-reflections-on-x-ray-reflectometry/) [![X-Ray Computed Tomography: The Superpower System](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2022/03/Ep6_Micro-v11-225x225-1.png) Webinar X-Ray Computed Tomography: The Superpower System 60 mins May 07, 2020](https://covalent.com/webinars/x-ray-computed-tomography-the-superpower-system/) [![Understanding the Testing, Inspection, Certification & Compliance (TICC) Industry and Why That Matters](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/themes/covalent/assets/images/resource-thumbnail.jpg) Blog Understanding the Testing, Inspection, Certification & Compliance (TICC) Industry and Why That Matters 7 min read Nov 15, 2023](https://covalent.com/blog/understanding-the-testing-inspection-certification-compliance-ticc-industry-and-why-that-matters/) [![Covalent’s Failure Analysis Group Delivers Enhanced X-Ray Inspection Services](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/09/Nordson-Dage-Quadra-7-PR_Featured-768x768.jpg) News Covalent’s Failure Analysis Group Delivers Enhanced X-Ray Inspection Services Feb 17, 2022](https://covalent.com/news/covalent-failure-analysis-group-delivers-enhanced-x-ray-inspection-services/) Need Expert Guidance? Our experts can help you determine if this approach is the best fit for your samples and discuss the next steps. [Talk to a Materials Scientist](https://covalent.com/contact-us/)