# Preparing Better TEM Samples Faster: Innovations in Automated FIB-SEM Workflows > As semiconductor devices continue to shrink below 10 nm, preparing high-quality TEM samples has become increasingly challenging. Engineers need thinner lamellae, greater placement accuracy, lower preparation damage, and higher throughput to support today’s advanced failure analysis and process development workflows. Join Covalent and Thermo Fisher Scientific for an in-depth look at the Helios 6 HD […] Source: https://covalent.com/webinars/automated-fib-sem-tem-sample-preparation/ Updated: 2026-07-28T15:02:21+00:00 --- ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2026/07/adobestock-1314783470-scaled.jpeg) ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2026/07/adobestock-1314783470-scaled.jpeg) # Preparing Better TEM Samples Faster: Innovations in Automated FIB-SEM Workflows 2026-08-20 11:00:00 | 2026-07-28 16:42:12 August 20, 2026, 11:00 am PT As semiconductor devices continue to shrink below 10 nm, preparing high-quality TEM samples has become increasingly challenging. Engineers need thinner lamellae, greater placement accuracy, lower preparation damage, and higher throughput to support today’s advanced failure analysis and process development workflows. Join Covalent and Thermo Fisher Scientific for an in-depth look at the Helios 6 HD DualBeam™ system and its latest innovations in automated TEM sample preparation. Through real world examples, you’ll learn how advances in ion optics, imaging, stage performance, and AI-powered automation are helping laboratories produce more consistent, higher-quality TEM specimens while reducing operator intervention. ## **What You’ll Learn** - Overcome Modern TEM Preparation Challenges: how advanced FIB-SEM workflows improve lamella quality, placement accuracy, and preparation consistency for today’s semiconductor devices. - Explore the Latest Helios 6 HD Innovations: how the Osprey ion column, enhanced imaging, precision stage control, and improved scan performance support higher-quality TEM sample preparation. - Increase Productivity with AutoTEM 6: how AI-powered automation enables unattended sample preparation, reduces operator variability, and increases laboratory throughput. - Improve Sample Quality Without Sacrificing Speed: practical strategies for preparing larger numbers of high-quality TEM samples while maintaining the precision required for advanced semiconductor analysis. - Interpret Results More Confidently: how to recognize and minimize preparation artifacts — and what to look for when evaluating lamella quality for advanced node analysis. ## **Who Should Attend** - Failure analysis engineers - Semiconductor process integration and process development engineers - TEM and FIB-SEM users - Materials characterization scientists - Laboratory managers seeking higher-throughput automation - Researchers working with advanced semiconductor devices Speakers: Esaul Garza Operations Director of Electron Microscopy, Covalent Esaul brings over 20 years of experience in low yield analysis, material characterization, and root cause failure analysis. He holds a degree in Materials Science and Microscopy from Lehigh University and an undergraduate degree in Electrical Engineering. His career includes a decade of R&D in the semiconductor industry supporting Intel flash and logic, expertise in hard-drive technology at Western Digital, and 9 years at Apple as a Senior Hardware Engineer and FA Manager — where he led the establishment of FA/EFA labs and developed FA procedures and capabilities for in-house and pre-production international vendors. [LinkedIn](https://www.linkedin.com/in/esaul-garza-2b433113/) Ondřej Bačo Product Marketing Manager, FIB-SEM, Thermo Fisher Scientific Ondřej Bačo is Product Marketing Manager of high-end FIB-SEM systems at Thermo Fisher Scientific in Czech Republic focusing on Semiconductor business. Previously he worked at R&D department as System Design Engineer and Technical Lead with expertise in charged particle optics and field emission electron sources. During his studies, his primary focus was on nanotechnology fabrication and characterization techniques including electron beam lithography, atomic force microscopy and transmission electron microscopy. [LinkedIn](https://www.linkedin.com/in/ond%C5%99ej-ba%C4%8Do-a022527a/) ## Recent Webinars [![Read time](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/07/clock.svg) 59mins Jun 18, 2026 ### Metallurgical Failure Analysis: Root Cause Investigations Understanding why materials fail is essential to improving reliability, safety, and performance. This webinar provides an overview of metallurgical failure analysis and the investigative techniques used to determine root causes in complex material and component failures. Attendees will learn how Covalent approaches failure investigations involving metallic alloys, welded assemblies, protective coatings, and fractured components. 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