# Tackling Miniaturization Challenges: High-Resolution Interface Analysis in Advanced Semiconductor Packaging > In this session, Dr. Naohiko Kawasaki from Toray Research Center (Japan) introduces powerful analytical techniques for investigating the chemical and physical properties of heterojunction interfaces in modern semiconductor devices. As microelectronic components become increasingly compact, understanding nanoscale interactions at bonding interfaces—such as those in 3D stacked structures and RDL (redistribution layer) interposers—is more important than […] Source: https://covalent.com/webinars/tackling-miniaturization-challenges-high-resolution-interface-analysis-in-advanced-semiconductor-packaging/ Updated: 2026-01-07T14:54:45+00:00 --- ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/06/tackling-miniaturization.jpg) ![](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/06/tackling-miniaturization.jpg) # Tackling Miniaturization Challenges: High-Resolution Interface Analysis in Advanced Semiconductor Packaging 2025-06-19 11:00:00 | 2026-05-26 21:33:00 June 19 2025, 11:00 am PT | 53 min In this session, **Dr. Naohiko Kawasaki** from **Toray Research Center (Japan)** introduces powerful analytical techniques for investigating the chemical and physical properties of heterojunction interfaces in modern semiconductor devices. As microelectronic components become increasingly compact, understanding nanoscale interactions at bonding interfaces—such as those in 3D stacked structures and RDL (redistribution layer) interposers—is more important than ever. ## Who Should Watch? This webinar is designed for everyone who is optimizing device performance, evaluating packaging reliability, or exploring new materials. This webinar will help you to enhance your nanoscale interface analysis strategy. ## What You’ll Learn About Analysis in Advanced Semiconductor Packaging: 1. How **AFM-IR** and **STEM-EELS** tools support chemical structure analysis of interface. 2. The role of ***in-situ* TEM** in assessing electrical properties at the nanoscale. 3. Case studies demonstrating **chemical analysis** of bonding interfaces and multi-layer stacks in packaging. ## About Interface Characterization Interface characterization refers to the study and analysis of the structural, chemical, and electrical properties at the boundaries between different materials or layers within a device. These interfaces—often only a few nanometers thick—can include bonding regions between metals, semiconductors, insulators, or polymers used in advanced electronic packaging. Characterization involves the use of high-resolution analytical techniques to gather detailed information about: - **Chemical composition** at the interface (e.g., presence of oxides, contaminants, or diffusion layers). - **Physical structure**, such as layer thickness, roughness, and crystalline orientation. - **Electrical behavior**, including resistance, conductivity, and failure mechanisms at junctions. By combining methods like AFM-IR, STEM-EELS, and in-situ TEM, scientists and engineers can map the distribution of elements, visualize nanoscale features, and measure electronic properties at the microscopic level. Speakers: Dr. Naohiko Kawasaki Manager of Electron Microscopic Analysis Team, Toray Research Center, Inc. Dr. Kawasaki’s experience of over twenty years in various nano-scale characterization techniques includes STEM-EELS, cathodoluminescence, and in-situ TEM. His background includes research positions at the University of Tokyo, Université Paris-Sud, and a Doctor of Science degree from Kyoto University. ## Recent Webinars [![Read time](https://spcdn.shortpixel.ai/spio/ret_img,q_cdnize,to_auto,s_webp:avif/covalent.com/wp-content/uploads/2025/07/clock.svg) 0mins Jun 18, 2026 ### Metallurgical Failure Analysis: Root Cause Investigations Understanding why materials fail is essential to improving reliability, safety, and performance. 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