This eBook explains how failure analysis helps engineering teams move from visible damage to defensible root cause. Using examples from metallurgical failure analysis, PCB/electronics failure analysis, polymer analysis, and component-level investigations, the guide walks through Covalent’s workflow: defining the problem, gathering service history, starting with non-destructive methods, moving into destructive analysis when needed, and using chemistry and microstructure to complete the story.
Topics include weld porosity, cratering, incomplete penetration, solder non-wetting, plated-through-hole defects, capacitor termination failures, connector contamination, fracture analysis, SEM/EDS, EBSD, micro-CT, SAM, dye-and-pry, cross-sectioning, and polymer FA decision pathways. The eBook emphasizes that effective failure analysis is not just defect hunting—it is a structured, multi-technique investigation that turns physical evidence into practical corrective action.