Atomic Absorption Spectroscopy (AAS)
Quantify trace metals from ppm to ppb with Atomic Absorption Spectroscopy (AAS) testing for liquids and digested solids used in material characterization.
Techniques
High‑resolution material data from the right techniques, applied by experts who know what it means for your product.
Chemical Analysis
Our chemical analysis capabilities reveal exactly what’s in a material and why it behaves the way it does. We detect contaminants, verify composition, and link chemical signatures to real-world performance. From pharmaceuticals to semiconductors, our analyses provide the clarity and confidence needed when material chemistry directly impacts safety, reliability, or outcomes.
Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)
Rapid, non-destructive chemical identification.
Auger Electron Spectroscopy (AES)
Measures Auger electrons for high-resolution surface analysis.
Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)
Quantifies elements and isotopes with nanometer depth profiling.
Electron Probe Microanalysis (EPMA)
Quantifies elemental composition at the micron scale.
Energy Dispersive X-ray Fluorescence (EDXRF)
Quick, non-destructive material composition & thickness analysis.
Fourier Transform Infrared Spectroscopy (FTIR)
Rapid, non-destructive molecular fingerprinting across materials.
Gas Chromatography-Mass Spectrometry (GC-MS)
Identifies and quantifies small organic molecules in mixtures.
Gel Permeation Chromatography (GPC)
Separates molecules by size to determine polymer properties.
Glow Discharge Optical Emission Spectroscopy (GDOES)
Sputters surfaces to quantify composition & depth-profile layers.
Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
Measures trace elements with high accuracy.
Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
Quantifies multiple elements at very low concentrations.
Ion Scattering Spectroscopy (ISS)
Identifies elements in the outermost atomic layer.
Nanoscale Secondary Ion Mass Spectrometry (NanoSIMS)
Ultra-high-resolution elemental and isotopic imaging.
Neutron Activation Analysis (NAA)
Quantifies elements via gamma rays from irradiated samples.
Nuclear Magnetic Resonance Spectroscopy (NMR)
Determines molecular structure, composition, and dynamics.
Photo-induced Force Microscopy (PiFM)
Nanoscale chemical characterization & topography at sub-5nm.
Raman Spectroscopy
Measures inelastic photon scattering for chemical identification.
Rutherford Backscattering Spectroscopy (RBS)
Quantifies elemental composition and thin-film thickness.
Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS)
Ultra-sensitive surface analysis with chemical imaging & depth profiling.
Total Reflection X-ray Fluorescence (TXRF)
TXRF is a surface sensitive elemental analysis technique used to determine the concentration of trace metal contamination on wafer surfaces.
Ultraviolet Photoelectron Spectroscopy (UPS)
Determines work function and valence electronic structure of surfaces.
Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)
Measures absorbance, reflectance, and transmittance (175–3300 nm).
Vapor Phase Decomposition-Inductively Coupled Plasma-Mass Spectrometry (VPD-ICPMS) Analysis
Quantifies ultra-trace metallic contamination on semiconductor wafer surfaces.
Wavelength Dispersive X‑Ray Fluorescence (WDXRF)
Non-destructive elemental composition & thin-film analysis.
White Light Interferometry (WLI)
Measures surface topography with sub-nanometer vertical resolution.
X-ray Absorption Spectroscopy (XAS)
Analyzes electronic structure of atoms and molecules.
X-ray Diffraction (XRD)
Non-destructive analysis of crystal phases, lattice, and strain.
X-ray Photoelectron Spectroscopy (XPS)
Measures surface elemental composition and chemical states.
Electron Microscopy
Electron microscopy uses focused electron beams to visualize features down to the atomic scale, far beyond optical microscopes. Covalent provides comprehensive electron microscopy services, including SEM and TEM, with integrated sample prep, imaging, analysis, and expert interpretation.
Atomic Resolution Electron Microscopy (AEM)
Images atoms and maps composition, bonding, and strain.
Differential Phase Contrast
Visualize local electric fields at the nanoscale.
Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
Combines ion milling and electron imaging for nanoscale analysis.
Laser Micro-Sample Preparation
Uses ultrafast lasers to rapidly prepare precise samples with minimal thermal damage.
Nanoprobing
Visualize local electric fields at the nanoscale.
Precession Electron Diffraction (PED)
PED is a TEM-based technique that rotates the electron beam for more precise crystallography at the nanoscale.
Scanning Electron Microscopy (SEM) Analysis
Images surface topography and composition with electrons.
Scanning Transmission Electron Microscopy (STEM)
Provides atomic-scale imaging and spectroscopic mapping.
Transmission Electron Microscopy (TEM)
Images atomic structure, defects, interfaces with sub-nm resolution.
Mechanical Testing
From nanoscale surface texture to bulk microstructure, Covalent delivers quantitative morphology and structural analysis that informs design, reliability, and process control.
Capillary Flow Porometry (CFP)
Characterizes through-pores in wettable, permeable materials.
Dye & Pry Testing
Reveals PCB solder joint cracks & defects.
Dynamic Mechanical Analysis (DMA)
Characterizes thermal and mechanical properties of soft materials.
Hardness Testing (Rockwell, Brinell, Shore)
Measures a material’s resistance to indentation and permanent deformation.
IPC Compliance Testing (IPC Compliance)
Verifies IPC-A-610 quality to reduce defects.
Mechanical Cross-Section Analysis (X-Section)
Uncovers microstructures and defects causing performance issues.
Nano-Scratch Test
Measures lateral/frictional force between tip & sample.
Nanoindentation
Determines mechanical properties including hardness & modulus.
Pendant Drop Surface Tension Measurement
Provides accurate liquid property analysis for surface tension.
Rheology
Evaluates material behavior during processing, storage, and use.
Tap Density
Ratio of sample mass to volume after mechanical tapping.
Tensile Testing
Measures material behavior under axial stretching (tension).
Thermomechanical Analysis (TMA)
Measures material dimension changes with temp, time, or force.
More Techniques
Dive deeper into our advanced material characterization methods. Our experts are ready to discuss your specific needs.
4-Point Probe (4PP) Measurement
Measures sheet resistance and resistivity accurately.
Scanning Capacitance Microscopy (SCM)
Maps charge carrier polarity/distribution in semiconductors.
Surface Free Energy (SFE)
Quantitative insight into surface energy for adhesion and coatings.
Vibrating Sample Magnetometry (VSM) Analysis
Measures magnetization, coercivity, and remanence under an applied magnetic field.
Water Contact Angle
Quantitative insight into surface interactions affecting adhesion.
Morphology and Structural Analysis
Our morphology and structural analysis services quantify the geometry and structure that govern performance. We deliver traceable surface texture metrics, pore-size distributions and connectivity, phase fractions, and texture indices, as well as thin-film stack models (thickness, density, and interfacial roughness), all mapped to your acceptance criteria. These analyses form the structural foundation for quality, yield, and reliability in manufacturing and R&D.
2D X-Ray Inspection
Delivers clear internal views of complex electronics.
Atomic Force Microscopy (AFM) Analysis
Maps nanoscale topography and material properties with a sharp probe.
Chromatic Confocal Profilometry & 3D Surface Profiling
Fast, non-contact 3D surface measurements.
Dynamic Light Scattering (DLS)
Quantifies particle size and uniformity in minutes.
Ellipsometric Porosimetry
Ellipsometric porosimetry measures adsorption- and desorption-induced changes in optical properties to determine film porosity and pore size distribution in porous samples.
Gas Adsorption Porosimetry
Characterizes porous materials.
Gas Pycnometry
Fast, precise measurements of true volume, density, and porosity.
Laser Diffraction Particle Size Analysis (LD-PSA)
Analyzes particle sizes by measuring light scattering.
Photo-induced Force Microscopy (PiFM)
Nanoscale chemical characterization & topography at sub-5nm.
Scanning Acoustic Microscopy (SAM)
Locates internal flaws like cracks, voids, and delamination.
Small Angle X-ray Scattering (SAXS)
Reveals nanoscale particle size, shape, spacing, and internal structure.
Structured Light Profilometry
Creates precise 3D models without contact or damage.
X-ray Computed Tomography (Micro-CT)
Non-contact, non-destructive 2D/3D images at micron scale.
X-ray Diffraction (XRD)
Non-destructive analysis of crystal phases, lattice, and strain.
X-ray Reflectometry (XRR)
Optimized scans tailored to each sample for best measurements.
Zeta Potential
Electric potential at the slipping plane of the EDL.
Optical Analysis
Decision-ready optical measurements for design, QA, and process control. We help you understand how your films, coatings, and optics perform so you can move forward with confidence.
Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)
Rapid, non-destructive chemical identification.
Cathodoluminescence (CL)
Maps bandgap, defects, and strain with SEM correlation.
Digital Optical Microscopy
Rapid, high-resolution imaging of a sample.
Dynamic Light Scattering (DLS)
Quantifies particle size and uniformity in minutes.
Fluorescence Microscopy
Rapid, high-resolution imaging of a sample.
Fourier Transform Infrared Spectroscopy (FTIR)
Rapid, non-destructive molecular fingerprinting across materials.
Infra-Red (IR) Thermography
Visualizes surface temperatures to reveal defects & hotspots.
Ion Chromatography (IC) Testing
Ion Chromatography (IC) is an analytical technique used to separate and quantify ions in samples across various industries such as electronics manufacturing, environmental testing, pharmaceuticals, food and beverage and others.
Laser Scanning Confocal Microscopy (LSCM)
Non-destructive 3D imaging of sample surfaces.
Petrographic Analysis
Examines mineral composition, microstructure, and defects using polarized light microscopy.
Photo-induced Force Microscopy (PiFM)
Nanoscale chemical characterization & topography at sub-5nm.
Photoluminescence (PL) Spectroscopy
Photoluminescence (PL) spectroscopy measures the luminescence spectrum emitted in response to optical excitation at a specified wavelength. Using a confocal microscope geometry, PL measurements can be performed with high spatial resolution.
Raman Spectroscopy
Measures inelastic photon scattering for chemical identification.
SNOM-Raman
Maps nanoscale stress and chemistry with 100 nm resolution.
Spectroscopic Ellipsometry (SE)
Measures thin-film thickness & optical properties.
Structured Light Profilometry
Creates precise 3D models without contact or damage.
Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)
Measures absorbance, reflectance, and transmittance (175–3300 nm).
Thermal Analysis
Trace transitions, resolve stability limits, and define processing and operating ranges for polymers, adhesives, composites, elastomers, and engineered materials.
Differential Scanning Calorimetry (DSC)
Quantifies heat flow for material optimization.
Dynamic Mechanical Analysis (DMA)
Characterizes thermal and mechanical properties of soft materials.
Infra-Red (IR) Thermography
Visualizes surface temperatures to reveal defects & hotspots.
Thermogravimetric Analysis (TGA)
Measures material mass changes with temperature or time.
Thermomechanical Analysis (TMA)
Measures material dimension changes with temp, time, or force.
Time-Domain Thermoreflectance (TDTR) Analysis
Time-Domain Thermoreflectance (TDTR) is an optical pump–probe technique used to measure thermal conductivity, thermal boundary conductance, and heat transport properties in thin films deposited on solid substrates.
Let's Solve Your Material Testing Challenges Together
Consult with our scientists to analyze failures, accelerate development, and optimize material performance.