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  • Services
    Services
    • Solutions
      Solutions

      Failure Analysis

      Root cause investigation of material, process, and device failures.

      Compositional Analysis

      Compositional analysis identifies the chemistry of a material, down to its elements, molecules, and phases. These measurements verify purity and detect impurities before they impact design, production, or compliance.

      Metrology Consulting Services

      Expert guidance on your metrology strategy and implementation.

      Quality Control Testing

      The difference between good and exceptional lies in the details. Covalent's Quality Control services delve into those details, providing the assurance that your materials and components consistently uphold the highest benchmarks.

      Metallurgical Analysis

      Correlating microstructure to processing, properties, and performance of your metallic alloy systems using advanced sample preparation, testing, imaging, and spectroscopy.

      Material Verification

      Material verification is about knowing exactly what is in your materials. By evaluating materials against the specifications provided, Covalent helps you prevent costly mistakes, failures, and compliance risks.

      Contamination Analysis

      Identify and resolve particulate, chemical, or organic contaminants that compromise material quality, yield, or device function.

      Performance Optimization

      Behind every high‑performing product is a series of deliberate choices about materials and process. Covalent partners with you to refine those choices, translating real‑world behavior into smarter tuning, higher yield, and greater reliability.

    • Applications
      Applications

      Surface & Interface Properties

      Characterize coatings, thin films, and contamination with advanced material analysis to improve reliability and performance.

      Mechanical Testing

      Measure mechanical properties with our engineering testing expertise to validate material integrity and ensure optimal performance.

      Chemical & Compositional Properties

      The elements and structures within a material determine whether a product is safe, reliable, and built to last. Covalent’s chemical composition analysis services give you the clearest possible view of that chemistry.

      Metals Testing

      Identify and quantify metal composition, microstructure, and mechanical properties to ensure performance, reliability, and compliance for your application.

      Coatings Testing 

      From corrosion resistance to biocompatibility, our testing ensures stronger products and global compliance.

      Powder Testing

      Covalent delivers specialized powder characterization services, including powder testing for particle size, shape, and flow. We support metal powder testing services and additive manufacturing powder testing to optimize performance in pharma, energy, and industrial applications.

      Optical Characterization Testing

      Covalent provides precise optical characterization services, delivering critical data on optical properties and thickness for materials, semiconductors, thin films and coatings. Our advanced optical characterization techniques ensure performance, reliability, and compliance.

      Polymer & Plastic Analysis

      Covalent offers comprehensive polymer & plastic testing lab services for polymer analysis, failure analysis, and quality control. Get fast, actionable data to ensure quality, performance, and compliance.

  • Techniques
    Techniques
      • Electron Microscopy
        Electron Microscopy

        Atomic Resolution Electron Microscopy (AEM)

        Images atoms and maps composition, bonding, and strain.

        Differential Phase Contrast

        Visualize local electric fields at the nanoscale.

        Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)

        Combines ion milling and electron imaging for nanoscale analysis.

        Nanoprobing

        Visualize local electric fields at the nanoscale.

        Precession Electron Diffraction (PED)

        PED is a TEM-based technique that rotates the electron beam for more precise crystallography at the nanoscale.

        Scanning Electron Microscopy (SEM) Analysis

        Images surface topography and composition with electrons.

        Scanning Transmission Electron Microscopy (STEM)

        Provides atomic-scale imaging and spectroscopic mapping.

        Transmission Electron Microscopy (TEM)

        Images atomic structure, defects, interfaces with sub-nm resolution.

      • Chemical Analysis
        Chemical analysis

        Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)

        Rapid, non-destructive chemical identification.

        Auger Electron Spectroscopy (AES)

        Measures Auger electrons for high-resolution surface analysis.

        Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)

        Quantifies elements and isotopes with nanometer depth profiling.

        Electron Probe Microanalysis (EPMA)

        Quantifies elemental composition at the micron scale.

        Energy Dispersive X-ray Fluorescence (EDXRF)

        Quick, non-destructive material composition & thickness analysis.

        Fourier Transform Infrared Spectroscopy (FTIR)

        Rapid, non-destructive molecular fingerprinting across materials.

        Gas Chromatography-Mass Spectrometry (GC-MS)

        Identifies and quantifies small organic molecules in mixtures.

        Gel Permeation Chromatography (GPC)

        Separates molecules by size to determine polymer properties.

        Glow Discharge Optical Emission Spectroscopy (GDOES)

        Sputters surfaces to quantify composition & depth-profile layers.

        Inductively Coupled Plasma Mass Spectrometry (ICP-MS)

        Measures trace elements with high accuracy.

        Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)

        Quantifies multiple elements at very low concentrations.

        Ion Scattering Spectroscopy (ISS)

        Identifies elements in the outermost atomic layer.

        Nanoscale Secondary Ion Mass Spectrometry (NanoSIMS)

        Ultra-high-resolution elemental and isotopic imaging.

        Neutron Activation Analysis (NAA)

        Quantifies elements via gamma rays from irradiated samples.

        Nuclear Magnetic Resonance Spectroscopy (NMR)

        Determines molecular structure, composition, and dynamics.

        Photo-induced Force Microscopy (PiFM)

        Nanoscale chemical characterization & topography at sub-5nm.

        Raman Spectroscopy

        Measures inelastic photon scattering for chemical identification.

        Rutherford Backscattering Spectroscopy (RBS)

        Quantifies elemental composition and thin-film thickness.

        Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS)

        Ultra-sensitive surface analysis with chemical imaging & depth profiling.

        Total Reflection X-ray Fluorescence (TXRF)

        TXRF is a surface sensitive elemental analysis technique used to determine the concentration of trace metal contamination on wafer surfaces.

        Ultraviolet Photoelectron Spectroscopy (UPS)

        Determines work function and valence electronic structure of surfaces.

        Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)

        Measures absorbance, reflectance, and transmittance (175–3300 nm).

        Wavelength Dispersive X‑Ray Fluorescence (WDXRF)

        Non-destructive elemental composition & thin-film analysis.

        White Light Interferometry (WLI)

        Measures surface topography with sub-nanometer vertical resolution.

        X-ray Absorption Spectroscopy (XAS)

        Analyzes electronic structure of atoms and molecules.

        X-ray Diffraction (XRD)

        Non-destructive analysis of crystal phases, lattice, and strain.

        X-ray Photoelectron Spectroscopy (XPS)

        Measures surface elemental composition and chemical states.

      • Optical Analysis
        Optical analysis

        Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)

        Rapid, non-destructive chemical identification.

        Cathodoluminescence (CL)

        Maps bandgap, defects, and strain with SEM correlation.

        Digital Optical Microscopy

        Rapid, high-resolution imaging of a sample.

        Dynamic Light Scattering (DLS)

        Quantifies particle size and uniformity in minutes.

        Electron Probe Microanalysis (EPMA)

        Quantifies elemental composition at the micron scale.

        Energy Dispersive X-ray Fluorescence (EDXRF)

        Quick, non-destructive material composition & thickness analysis.

        Fluorescence Microscopy

        Rapid, high-resolution imaging of a sample.

        Fourier Transform Infrared Spectroscopy (FTIR)

        Rapid, non-destructive molecular fingerprinting across materials.

        Infra-Red (IR) Thermography

        Visualizes surface temperatures to reveal defects & hotspots.

        Laser Scanning Confocal Microscopy (LSCM)

        Non-destructive 3D imaging of sample surfaces.

        Photo-induced Force Microscopy (PiFM)

        Nanoscale chemical characterization & topography at sub-5nm.

        Raman Spectroscopy

        Measures inelastic photon scattering for chemical identification.

        SNOM-Raman

        Maps nanoscale stress and chemistry with 100 nm resolution.

        Spectroscopic Ellipsometry (SE)

        Measures thin-film thickness & optical properties.

        Structured Light Profilometry

        Creates precise 3D models without contact or damage.

        Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)

        Measures absorbance, reflectance, and transmittance (175–3300 nm).

        X-ray Absorption Spectroscopy (XAS)

        Analyzes electronic structure of atoms and molecules.

      • Mechanical Testing
        Mechanical Testing

        Capillary Flow Porometry (CFP)

        Characterizes through-pores in wettable, permeable materials.

        Dye & Pry Testing

        Reveals PCB solder joint cracks & defects.

        Dynamic Mechanical Analysis (DMA)

        Characterizes thermal and mechanical properties of soft materials.

        IPC Compliance Testing (IPC Compliance)

        Verifies IPC-A-610 quality to reduce defects.

        Mechanical Cross-Section Analysis (X-Section)

        Uncovers microstructures and defects causing performance issues.

        Nano-Scratch Test

        Measures lateral/frictional force between tip & sample.

        Nanoindentation

        Determines mechanical properties including hardness & modulus.

        Pendant Drop Surface Tension Measurement

        Provides accurate liquid property analysis for surface tension.

        Rheology

        Evaluates material behavior during processing, storage, and use.

        Tap Density

        Ratio of sample mass to volume after mechanical tapping.

        Tensile Testing

        Measures material behavior under axial stretching (tension).

        Thermomechanical Analysis (TMA)

        Measures material dimension changes with temp, time, or force.

      • Thermal Analysis
        Thermal Analysis

        Differential Scanning Calorimetry (DSC)

        Quantifies heat flow for material optimization.

        Dynamic Mechanical Analysis (DMA)

        Characterizes thermal and mechanical properties of soft materials.

        Infra-Red (IR) Thermography

        Visualizes surface temperatures to reveal defects & hotspots.

        Thermogravimetric Analysis (TGA)

        Measures material mass changes with temperature or time.

        Thermomechanical Analysis (TMA)

        Measures material dimension changes with temp, time, or force.

      • Morphology & Structural Analysis
        Morphology & Structural Analysis

        2D X-Ray Inspection

        Delivers clear internal views of complex electronics.

        Atomic Force Microscopy (AFM) Analysis

        Maps nanoscale topography and material properties with a sharp probe.

        Chromatic Confocal Profilometry & 3D Surface Profiling

        Fast, non-contact 3D surface measurements.

        Dynamic Light Scattering (DLS)

        Quantifies particle size and uniformity in minutes.

        Gas Adsorption Porosimetry

        Characterizes porous materials.

        Gas Pycnometry

        Fast, precise measurements of true volume, density, and porosity.

        Laser Diffraction Particle Size Analysis (LD-PSA)

        Analyzes particle sizes by measuring light scattering.

        Photo-induced Force Microscopy (PiFM)

        Nanoscale chemical characterization & topography at sub-5nm.

        Scanning Acoustic Microscopy (SAM)

        Locates internal flaws like cracks, voids, and delamination.

        Structured Light Profilometry

        Creates precise 3D models without contact or damage.

        X-ray Computed Tomography (Micro-CT)

        Non-contact, non-destructive 2D/3D images at micron scale.

        X-ray Diffraction (XRD)

        Non-destructive analysis of crystal phases, lattice, and strain.

        X-ray Reflectometry (XRR)

        Optimized scans tailored to each sample for best measurements.

        Zeta Potential

        Electric potential at the slipping plane of the EDL.

      • More Techniques
        More Techniques

        4-Point Probe (4PP) Measurement

        Measures sheet resistance and resistivity accurately.

        Scanning Capacitance Microscopy (SCM)

        Maps charge carrier polarity/distribution in semiconductors.

        Surface Free Energy (SFE)

        Quantitative insight into surface energy for adhesion and coatings.

        Water Contact Angle

        Quantitative insight into surface interactions affecting adhesion.

      • Explore All Techniques
    • Resources
      Resources
      • Webinars
        Webinars
        Close-up of a microchip with detailed circuitry and glowing elements.

        Beyond the Surface: Next-Generation Scanning Acoustic Microscopy

        Scanning Acoustic Microscopy (SAM) is a powerful tool for non-destructive evaluation of internal features such as voids, delamination, and cracks…

        Watch Now

        An Introduction to Fluorine NMR and its polymer applications

        Nuclear magnetic resonance (NMR) is a powerful analytical technique which unveils the molecular structure by detecting the magnetic spins of…

        Watch Now
      • Blogs
        Blogs
        What are the applications of alumina?

        What are the applications of alumina?

        Alumina as an Engineering Material Alumina (Al₂O₃) is one of the most widely used ceramic materials, valued for its…
        Explore
        Microplastics in Drinking Water Are Under EPA Scrutiny. How Do Labs Detect Them? 

        Microplastics in Drinking Water Are Under EPA Scrutiny. How Do Labs Detect Them? 

        Microplastics are no longer just an environmental buzzword. They are increasingly part of a public conversation about water quality, consumer safety, and chemical…
        Explore
      • News
        News
        Portrait of Damien Fischer, new Vice President at Covalent.

        Covalent Appoints Damien Fischer as Vice President of Commercial Strategy & Growth

        New role strengthens Covalent’s market development, customer growth, and strategic partnership capabilities as the company enters its next stage of…

        Explore
        Visual diagram of Covalent Connect's problem-first platform for materials analysis.

        Covalent Launches “Covalent Connect,” Unlocking Seamless Access to the World’s Most Advanced Materials Characterization Capabilities

        New platform enables faster solutions to complex product challenges by integrating global metrology infrastructure and expertise

        Sunnyvale, CA — [Wednesday,…

        Explore
      • Library
        Library
        Roman Coin Characterization Case Study

        Roman Coin Characterization Case Study

        This case study presents a multi-technique, fully non-destructive characterization of two Roman coins from the reign of Julian II (361–363…

        Explore
        PED and DPC

        PED and DPC

        Precession Electron Diffraction (PED) and Differential Phase Contrast (DPC) help reveal the nanoscale structural and electrostatic features that often control…

        Explore
    • Company
      Company
      • About Us
        About Us
        About

        Covalent transforms complex material testing data into clear, actionable insights. From failure analysis to advanced compositional studies, we partner with innovators across industries to accelerate development and optimize performance.

        Learn more
      • Team
        Team

        We’re scientists, engineers, and problem-solvers first. Over 70% of us hold PhDs or advanced degrees. Every engagement is led by credentialed experts who combine deep technical knowledge with practical solutions tailored to your toughest challenges.

        Meet the team
      • Partners
        Partners

        Trusted by 1,500+ global manufacturers, OEMs, and R&D teams, Covalent builds long-term partnerships that deliver results at scale. Backed by $25M in tools and ISO-accredited methods, we focus on just one thing: data you can act on with confidence.

        Explore our partnerships
      • Careers
        Careers

        Join a team that's shaping the future of material insights. At Covalent, you'll work with world-class scientists, cutting-edge technology, and global industry leaders, all while making a measurable impact.

        View careers
      • Accreditations & Quality
        Accreditations & Quality

        Quality is foundational to our work. Covalent is ISO accredited and operates under a rigorous quality management system. Our processes, data, and results meet internationally recognized standards so you can trust every measurement and insight we deliver.

        Learn more
      • Covalent Core Lab
        Covalent Core Lab
        Technician operating advanced laboratory equipment at Covalent.
        A technician working with high-tech lab machinery in a clean, modern laboratory setting.

        The Covalent Core Lab provides advanced material characterization and analytical testing performed by Covalent scientists using state-of-the-art instrumentation to deliver fast, reliable results

        Learn more
      • Covalent Connect
        Covalent Connect
        Blockchain data network connecting labs, universities, and research institutions.
        Covalent's network links labs, universities, and research institutions for blockchain data sharing and collaboration.

        Covalent Connect provides access to specialized material characterization and testing services through a network of partner laboratories, guided by Covalent scientists for fast, reliable results.

        Learn more
    • Nexus Membership
    Contact Us
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    Home/Webinars

    Webinar

    Explore expert-led webinars on failure analysis, interfaces, thin films, and more. Learn how leading R&D teams use advanced analytical techniques to solve real-world engineering problems.

    Read time

    57 mins

    Close-up of a microchip with detailed circuitry and glowing elements.
    Apr 16, 2026

    Beyond the Surface: Next-Generation Scanning Acoustic Microscopy

    Scanning Acoustic Microscopy (SAM) is a powerful tool for non-destructive evaluation of internal features such as voids, delamination, and cracks but traditional systems have limitations in scale, geometry, and data interpretation.In this webinar, Covalent and PVA TePla will showcase how new advances in large-format scanning, rotational inspection, and machine learning are overcoming these challenges enabling…

    Read time

    58 mins

    Feb 19, 2026

    An Introduction to Fluorine NMR and its polymer applications

    Nuclear magnetic resonance (NMR) is a powerful analytical technique which unveils the molecular structure by detecting the magnetic spins of a selected isotope. Fluorine-19 (19F) NMR is the primary characterization technique for fluorinated materials, which are widely used in advanced applications, such as energy storage, pharmaceuticals, semiconductors, and optical coatings. In this webinar, we will…

    Read time

    53 mins

    Under the Microscope: Your Electron Microscopy Questions Answered
    Dec 4, 2025

    Under the Microscope: Your Electron Microscopy Questions Answered

    The session provides straightforward guidance for improving imaging workflows, selecting the right technique, preparing samples effectively, and interpreting complex microstructural and compositional features. This on-demand webinar gives you access to the full recording of our live session where experts addressed the most common and practical questions engineers and scientists encounter when using electron microscopy. Viewers…

    Read time

    53 mins

    Unveiling the Nanoscale: PiFM for Chemical, Structural, and Surface Characterization
    Oct 16, 2025

    Unveiling the Nanoscale: PiFM for Chemical, Structural, and Surface Characterization

    This presentation will illustrate how Photo-induced Force Microscopy (PiFM) can deliver unprecedented levels of chemical composition analysis, molecular binding environments, and surface topography, facilitating a more complete understanding of materials for a wide range of applications. Through hands-on examples, it will illustrate how Atomic Force Microscopy combined with Infrared Spectroscopy enables scientists to probe the…

    Read time

    53 mins

    Aug 21, 2025

    From Malfunction to Solution – Advanced Failure Analysis for Materials & Electronics

    This webinar is planned to take you deep into today's highest-quality Failure Analysis (FA) techniques for diagnosing difficult challenges in electronics and advanced technologies. You will discover how tailored analysis plans and latest methods can effectively address even the toughest-to-solve failures by revealing root cause sources. Practical case studies showing the efficacy of this process…

    Read time

    53 mins

    Tackling Miniaturization
    Jun 19, 2025

    Tackling Miniaturization Challenges: High-Resolution Interface Analysis in Advanced Semiconductor Packaging

    In this session, Dr. Naohiko Kawasaki from Toray Research Center (Japan) introduces powerful analytical techniques for investigating the chemical and physical properties of heterojunction interfaces in modern semiconductor devices. As microelectronic components become increasingly compact, understanding nanoscale interactions at bonding interfaces—such as those in 3D stacked structures and RDL (redistribution layer) interposers—is more important than…

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