Under the Microscope: Your Electron Microscopy Questions Answered

2025-12-04 11:00:00 | 2026-04-15 21:33:53

The session provides straightforward guidance for improving imaging workflows, selecting the right technique, preparing samples effectively, and interpreting complex microstructural and compositional features.

This on-demand webinar gives you access to the full recording of our live session where experts addressed the most common and practical questions engineers and scientists encounter when using electron microscopy. Viewers can now watch the event at their convenience and learn directly from real examples and audience questions discussed during the live presentation.

Who Should Attend?

This on demand webinar is valuable for professionals who rely on high resolution imaging and materials characterization, including:

  • Materials scientists and engineers.
  • Semiconductor packaging and device engineers.
  • Failure analysis specialists.
  • Researchers studying morphology, interfaces, or microstructure.
  • Both new and experienced electron microscopy users looking for practical, experience driven insights.

What You’ll Learn

During the live session, the presenter walked through foundational concepts and user submitted questions that helped attendees:

  • Understand the differences between SEM, TEM, and FIB and when each technique is best suited for specific applications.
  • Improve imaging quality by adjusting beam parameters, detector choices, and contrast settings.
  • Recognize and troubleshoot common artifacts such as charging, beam damage, and curtaining.
  • Apply sample preparation methods that yield more reliable imaging results.
  • Interpret microstructural and compositional information with greater clarity.

All these insights are captured in the on-demand recording and available to you for continued reference.

About Electron Microscopy

Electron microscopy enables exceptional resolution and contrast for analyzing surfaces, interfaces, defects, and internal structures at the micro and nanoscale. Unlike optical microscopy, these techniques use focused electron beams to reveal fine details essential for semiconductor packaging, energy storage systems, advanced materials, and failure analysis.

This webinar provides practical explanations and real-world examples to help users better understand how electron microscopy methods can support their work and how to navigate common challenges during analysis.

Speakers:
Yi Zhang
Yi Zhang

Director of Electron Microscopy, Covalent

Yi Zhang is an electron microscopist with over 16 years of experience applying advanced S/TEM techniques to study diverse materials. His research and industry work across the US, Europe, and Asia reflect his strong background in cross-disciplinary collaboration and analytical problem-solving. Yi earned his Ph.D. in Materials Science and Engineering from Nanjing University and completed postdoctoral research at the University of Michigan and Stockholm University. Before joining Covalent, he was a senior research scientist at the RENEW Institute, University at Buffalo.
Kevin Wu
Kevin Wu

Electron Microscopy Metrology Manager, Covalent

Kevin Wu is the Electron Microscopy Metrology Manager at Covalent Metrology, bringing over a decade of experience in materials characterization and process engineering. He specializes in SEM, FIB, EDS, and EBSD techniques and has applied his expertise across industries such as semiconductors, batteries, and advanced manufacturing. Kevin holds both a B.S. and M.S. in Materials Science and Engineering from the University of California, Berkeley.
Esaul Garza
Esaul Garza

Operations Director of Electron Microscopy, Covalent

Esaul joined Covalent Metrology in 2024 and leads process workflow development for TEM operations. He brings over 20 years of experience in materials characterization, low-yield analysis, and root-cause failure analysis across leading-edge semiconductors, hard drive, and display technologies.
Valerie Brogden
Valerie Brogden

Technical Operations and Marketing, Covalent

Valerie Brogden brings nearly 15 years of expertise in advanced metrology, characterization, and failure analysis, with a focus on FIB/SEM techniques. She has managed a multi-instrument lab supporting both academic and industry research, served as a technical session chair for multiple FIB conferences, and pioneered the first fully automated TEM sample preparation through automated lift-out. Valerie has taught graduate-level courses at the University of Oregon and holds several patents and publications in FIB/SEM innovation.
Ben Buford
Ben Buford

Technical Director of Software and Algorithms, Rigaku

Ben Buford is a Technical Director of Software and Algorithms at Rigaku, where he develops advanced data-analysis methods for x-ray metrology tools. He earned a PhD in Electrical Engineering from Oregon State University and has worked at Intel and Covalent Metrology developing physics-guided approaches to data analysis of TEM-EDX and other metrology techniques.

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