What Is a Nanoindentation Test?
Nanoindentation is used to characterize hardness and elastic modulus in thin films, coatings, and other small or site-specific regions. Its micron-scale spatial resolution makes it useful for targeted measurements on devices and components.
The test records very small applied forces and corresponding penetration depths, then analyzes the load–displacement response to calculate material properties and understand deformation behavior.
High-Resolution Mechanical Testing
Dynamic Analysis Capability
Dynamic testing can be performed using DMA/SINUS-type loading on Covalent instrumentation.
Temperature-Dependent Profiling
Mechanical properties can be measured as a function of temperature.
Why Use Nanoindentation?
The system can provide load–displacement data and derived properties including elastic modulus, hardness, creep response, stiffness, yield-related behavior, and storage/loss modulus. Fracture toughness (KIC) can be determined by measuring indenter-induced cracks with an SEM.
Compared with conventional macroindentation methods such as Vickers or Brinell, nanoindentation uses much smaller loads and penetration depths, which can eliminate substrate influence when testing thin coatings.
Material Compatibility
Applicable to many solid materials including plastics, metals, ceramics, coatings, and thin films. Very soft materials such as hydrogels and some biopolymers can be more difficult to test.
Resolution / Measurement Scale
Depth resolution is approximately 0.01 nm and load resolution is in the micronewton range. Lateral accuracy of the motor stage is typically in the micron range.
Depth Profiling
SINUS/dynamic loading or progressive multi-cycle methods can be used to evaluate how mechanical response changes with penetration depth.
How Nanoindentation Works
In SINUS mode, a small oscillatory load is superimposed on the test to measure mechanical response dynamically. This can support interpretation of properties such as stiffness and viscoelastic response and, in some cases, conversion to stress–strain-type behavior.
Covalent’s configuration includes a reference indenter for stable surface-contact detection and a heated stage for measurements from room temperature to about 200 °C.
During unloading, the slope of the load–displacement curve is used to determine elastic response, while hardness is calculated from applied load and the indenter contact area.
Equipment Used for Nanoindentation
Anton Paar STeP (Standard Testing Platform) 600
The Anton Paar STeP 600 platform at Covalent includes three testing heads:
UNHT3 — Ultra Nanoindentation Tester
- Supports sinusoidal loading for dynamic mechanical testing.
- Includes a temperature-controlled sample stage from room temperature to approximately 200 °C for hardness, modulus, and viscoelastic measurements versus temperature.
MCT3 — Micro-Combi Tester
Used for micro-indentation and micro-scratch measurements.
NST3 — Nano-Scratch Tester
Used for nanoscale scratch and coating-response measurements.
Key Differentiators
Key capabilities include SINUS-mode dynamic mechanical testing and a reference-indenter approach that helps maintain reliable surface contact during long-duration measurements or testing of relatively soft/time-dependent materials.
Strengths
- Small force and displacement resolution for thin coatings and small features.
- Room-temperature to 200 °C property profiling.
- Dynamic mechanical testing for viscoelastic materials.
Limitations
- Concave sample surfaces are generally not ideal and might require additional sample preparation prior to testing.
- Features at or below roughly 5 µm can be difficult to measure accurately depending on geometry and setup.
- Very soft materials may require alternate approaches or partner-lab capabilities.
- High surface roughness can increase measurement variability.
Example Outputs
AFM imaging can be used to inspect indents in reference materials such as fused quartz and to support verification of contact geometry or calibration.
Indentation and progressive-load scratch tests can compare coating systems; differences in penetration under the same load can indicate differences in hardness or resistance to deformation.
Sample Requirements
Samples should be solid and preferably flat. Non-flat samples may require mechanical preparation. Surface roughness may also need to be characterized so that an appropriate load and penetration depth can be selected.
Nanoindentation Applications by Industry
Semiconductor
Mechanical-property measurements on low-k dielectric and other thin-film structures.
Battery
Hardness measurements on isolated graphite or other electrode particles.
Consumer Electronics
Localized measurements on small device features and layered structures, including advanced logic-device materials.
Medical
Temperature-dependent storage/loss modulus measurements of pressure-sensitive adhesives used in sensors and other devices.
Techniques That Complement Nanoindentation
Techniques such as ICP-OES, SEM-EDS, or GD-OES can be used to correlate film chemistry with measured mechanical properties.
Progressive-load scratch testing can characterize shear, delamination, and coating adhesion behavior and can be compared with hardness data.
Microscopy can document indent morphology and cracks. For fracture-toughness-related analysis, crack lengths extending from indent edges may be measured.
Why Choose Covalent for Your Nanoindent Needs?
Covalent performs nanoindentation using the Anton Paar STeP 600 platform with UNHT3 dynamic/SINUS capability and a temperature-controlled stage. The reference-indenter configuration supports stable contact during time-dependent measurements, and live collaboration during setup can help tailor loads, locations, and outputs to the application.
Frequently Asked Questions
What properties can Nanoindent measure?
Common outputs include hardness, elastic modulus, creep response, stiffness, yield-related behavior, fracture-related response, and dynamic storage/loss modulus.
What types of materials can be tested?
Metals, ceramics, plastics, coatings, and thin films are common candidates.
What are the spatial and depth resolutions?
Depth resolution is approximately 0.01 nm, load resolution is approximately 1 µN.
What complementary techniques are useful?
Optical microscopy or SEM can visualize indents and cracks, while scratch testing can evaluate coating adhesion, shear, and delamination behavior.
Can mechanical properties be measured at elevated temperature?
Yes. The UNHT3 setup includes a heating stage for measurements from room temperature to approximately 200 °C.