What Is Cross-Sectional Analysis (X-Section)?
Cross-sectional analysis is an analysis technique for quality control and failure analysis. When combined with tools like optical microscopy (OM), electron microscopy (EM), and energy dispersive X-ray spectroscopy (EDS), it examines material microstructures, characterizes critical defects, and develops strategic solutions.
With state-of-the-art processes and equipment, our engineers and technicians are able to cross-section features as small as 10 microns and develop methodologies for mechanical cross-sectioning of many different kinds of products.
Sample sectioning: Covalent offers sectioning capabilities for isolating regions of interest using tools like diamond wire saws, suitable for polymers, metals, glasses, and ceramics.
Grinding: Our laboratory offers various grinding media, including SiC grinding paper, diamond lapping paper, and resin-bonded discs, for preparing cross-sections from any material.
Polishing: We use alumina, colloidal silica, and polycrystalline diamond suspensions with polishing pads to produce scratch-free cross-sections. Vibratory polishing is available for samples needing minimal subsurface deformation.
Etching: We etch metals and alloys for grain structure analysis using chemical and plasma etching. Our chemists can produce custom etchants in-house if needed.
Other Details:
- Suitable for polymers, metals, glass, and ceramic materials.
- Sic grinding and diamond lapping paper, resin-bonded discs.
- Scratch-free cross-sections using diamond suspensions using polish pads.
- In-house custom etchants for metals and alloys.
Versatile Across Materials
Foundation for Strategic Solutions
High-Resolution Defect Insight
Why Use X-Section?
Cross-sectional analyses are key for characterizing the cause and effect of material defects or anomalies on the mechanical and chemical properties of components. They enable detailed analysis of the cause and location of defects, such as contamination at blind through interfaces in PCBs or determining crack morphology in stainless-steel pipeline welds.Cross sectional analysis gives a detailed look into product defects that could, or have, lead to premature failure. Cross-sectional analysis is used in industries including semiconductors, aerospace, biomedical, energy storage, and infrastructure.
- Provides physical, structural, and morphological information.
- Reveals layer thicknesses, interfacial features, voids, cracks, delamination, and manufacturing defects.
- Enables visual inspection and compositional analysis when coupled with microscopy techniques.
- Compatible with a wide range of materials, including:
- Metals.
- Ceramics.
- Polymers.
- Composites.
- Semiconductors.
- Can be used on multilayered or heterogeneous structures.
Failure Prevention & Reliability
Actionable Quality Control
Cross‑Industry Relevance
How X-Section Works
The sample is first mounted in resin or epoxy to stabilize the component of interest and then sectioned (cut) using a precision saw (e.g., diamond saw). Once cut, the sample is ground and polished in stages using abrasive pads and fine polishing agents. The final result is a flat, smooth cross-section and is examined to study internal structures, layers, interfaces, or defects.
Equipment Used for X-Section
Diamond Wire Saw DWS.375E
- Vertical, endless diamond wire saw with max workpiece cutting area of 350 × 375 mm and max sample weight of 30 kg.
- Uses 3000 mm diamond wire loops (0.30 to 0.80 mm diameter) with continuously adjustable wire speed from 4 to 12 m/s for wet or dry cutting.
- Constant cutting pressure via gravity feed and industrial-grade drive/control technology for precise, robust operation.
- Color touch-panel control with multi-language interface (DE, EN, FR, ES, JP, CN) and integrated safety sensors for end-of-cut, open hood, and wire break detection.
Buehler AutoMet 300 Pro Grinder-Polisher
- 12″ [305 mm] platen and 2 hp [1500 W] base motor designed for demanding production lab environments and larger or multiple samples.
- Color touchscreen control with method creation/storage and Z-axis material removal by depth; supports manual or automated preparation.
- Platen speed 50 to 400 rpm (clockwise or counter-clockwise) with optional automated dispenser for cost savings and highly reproducible results.
- Integrated rinse and spin function, retractable water hose, and bowl liners for fast, simplified cleaning during grinding and polishing workflows.
Key Differentiators
Covalent’s cross‑sectional analysis stands out for its precision, consistency, and adaptability. It delivers clear views with minimal artifacts across even the most complex material systems.
Strengths
- Direct Visualization: Offers a clear, physical view of internal structures, layers, and defects.
- Cost-Effective: Equipment (saws, polishers) is generally less expensive compared to high-end techniques like FIB (Focused Ion Beam).
- Broad Material Compatibility: Suitable for metals, ceramics, polymers, composites, and semiconductor materials.
- Good for Layer Thickness Measurement: Enables accurate measurement of coatings, films, and multilayer stacks.
- Prepares Samples for Multiple Techniques: Cross-sections can be analyzed with optical microscopy, SEM, EDS, and other surface-sensitive techniques.
Limitations
- Destructive Technique: The process permanently alters or destroys the sample.
- Limited Depth Profiling Precision: Cannot provide continuous depth profiling like SIMS or AES; it only shows a snapshot at the sectioned plane.
- Risk of Sample Damage: Cutting or polishing may introduce artifacts like smearing, cracking, or delamination if not done carefully.
- Labor-Intensive Preparation: Requires multiple steps (mounting, cutting, grinding, polishing), which can be time-consuming.
- Resolution Limited by Analysis Method: While sectioning exposes features, the final detail depends on the resolution of the follow-up analysis (e.g., SEM vs. optical microscopy).
Example Outputs
Sample Requirements
Size and Shape: Depending on the size and shape of the sample, samples may need trimming and custom fixturing to mechanically cross-section. Providing smaller samples will limit the amount of sample preparation time needed to perform this process.
Techniques That Complement X-Section
Why Choose Covalent for Your X-Section Needs?
With expertise in printed circuit boards (PCBs) and other intricate assemblies, Covalent specializes in producing high-quality mechanical cross-sections of complex multilayer samples. Our precision processes are optimized for revealing internal structures, interfaces, and layer integrity within complex material systems. We work with a wide range of materials, ensuring edge retention and minimal damage even in delicate or heterogeneous samples. Whether analyzing solder joints in PCBs or evaluating the interface between dissimilar materials, Covalent delivers consistent, high-resolution cross-sections tailored for advanced analytical techniques such as SEM, EDS, and optical microscopy. Our capability to handle diverse material stacks makes us your trusted partner for accurate failure analysis, quality control, and material characterization.