Atomic Resolution Electron Microscopy (AEM)
Images atoms and maps composition, bonding, and strain.
Differential Phase Contrast
Visualize local electric fields at the nanoscale.
Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
Combines ion milling and electron imaging for nanoscale analysis.
Precession Electron Diffraction (PED)
PED is a TEM-based technique that rotates the electron beam for more precise crystallography at the nanoscale.
Scanning Electron Microscopy (SEM)
Images surface topography and composition with electrons.
Scanning Transmission Electron Microscopy (STEM)
Provides atomic-scale imaging and spectroscopic mapping.
Transmission Electron Microscopy (TEM)
Images atomic structure, defects, interfaces with sub-nm resolution.
Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)
Rapid, non-destructive chemical identification.
Auger Electron Spectroscopy (AES)
Measures Auger electrons for high-resolution surface analysis.
Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)
Quantifies elements and isotopes with nanometer depth profiling.
Electron Probe Microanalysis (EPMA)
Quantifies elemental composition at the micron scale.
Energy Dispersive X-ray Fluorescence (EDXRF)
Quick, non-destructive material composition & thickness analysis.
Fourier Transform Infrared Spectroscopy (FTIR)
Rapid, non-destructive molecular fingerprinting across materials.
Gas Chromatography-Mass Spectrometry (GC-MS)
Identifies and quantifies small organic molecules in mixtures.
Gel Permeation Chromatography (GPC)
Separates molecules by size to determine polymer properties.
Glow Discharge Optical Emission Spectroscopy (GDOES)
Sputters surfaces to quantify composition & depth-profile layers.
Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
Measures trace elements with high accuracy.
Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
Quantifies multiple elements at very low concentrations.
Ion Scattering Spectroscopy (ISS)
Identifies elements in the outermost atomic layer.
Nanoscale Secondary Ion Mass Spectrometry (NanoSIMS)
Ultra-high-resolution elemental and isotopic imaging.
Neutron Activation Analysis (NAA)
Quantifies elements via gamma rays from irradiated samples.
Nuclear Magnetic Resonance Spectroscopy (NMR)
Determines molecular structure, composition, and dynamics.
Photo-induced Force Microscopy (PiFM)
Nanoscale chemical characterization & topography at sub-5nm.
Raman Spectroscopy
Measures inelastic photon scattering for chemical identification.
Rutherford Backscattering Spectroscopy (RBS)
Quantifies elemental composition and thin-film thickness.
Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS)
Ultra-sensitive surface analysis with chemical imaging & depth profiling.
Total Reflection X-ray Fluorescence (TXRF)
TXRF is a surface sensitive elemental analysis technique used to determine the concentration of trace metal contamination on wafer surfaces.
Ultraviolet Photoelectron Spectroscopy (UPS)
Determines work function and valence electronic structure of surfaces.
Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)
Measures absorbance, reflectance, and transmittance (175–3300 nm).
Wavelength Dispersive X‑Ray Fluorescence (WDXRF)
Non-destructive elemental composition & thin-film analysis.
White Light Interferometry (WLI)
Measures surface topography with sub-nanometer vertical resolution.
X-ray Absorption Spectroscopy (XAS)
Analyzes electronic structure of atoms and molecules.
X-ray Diffraction (XRD)
Non-destructive analysis of crystal phases, lattice, and strain.
X-ray Photoelectron Spectroscopy (XPS)
Measures surface elemental composition and chemical states.
Cathodoluminescence (CL)
Maps bandgap, defects, and strain with SEM correlation.
Digital Optical Microscopy
Rapid, high-resolution imaging of a sample.
Dynamic Light Scattering (DLS)
Quantifies particle size and uniformity in minutes.
Infra-Red (IR) Thermography
Visualizes surface temperatures to reveal defects & hotspots.
Laser Scanning Confocal Microscopy (LSCM)
Non-destructive 3D imaging of sample surfaces.
SNOM-Raman
Maps nanoscale stress and chemistry with 100 nm resolution.
Spectroscopic Ellipsometry (SE)
Measures thin-film thickness & optical properties.
Structured Light Profilometry
Creates precise 3D models without contact or damage.
Capillary Flow Porometry (CFP)
Characterizes through-pores in wettable, permeable materials.
Dye & Pry Testing
Reveals PCB solder joint cracks & defects.
Dynamic Mechanical Analysis (DMA)
Characterizes thermal and mechanical properties of soft materials.
IPC Compliance Testing (IPC Compliance)
Verifies IPC-A-610 quality to reduce defects.
Mechanical Cross-Section Analysis (X-Section)
Uncovers microstructures and defects causing performance issues.
Nano-Scratch Test
Measures lateral/frictional force between tip & sample.
Nanoindentation
Determines mechanical properties including hardness & modulus.
Pendant Drop Surface Tension Measurement
Provides accurate liquid property analysis for surface tension.
Rheology
Evaluates material behavior during processing, storage, and use.
Tap Density Analysis
Ratio of sample mass to volume after mechanical tapping.
Tensile Testing
Measures material behavior under axial stretching (tension).
Thermomechanical Analysis (TMA)
Measures material dimension changes with temp, time, or force.
Differential Scanning Calorimetry (DSC)
Quantifies heat flow for material optimization.
Thermogravimetric Analysis (TGA)
Measures material mass changes with temperature or time.
2D X-Ray Inspection
Delivers clear internal views of complex electronics.
Atomic Force Microscopy (AFM)
Maps nanoscale topography and material properties with a sharp probe.
Chromatic Confocal Profilometry & 3D Surface Profiling
Fast, non-contact 3D surface measurements.
Gas Adsorption Porosimetry
Characterizes porous materials.
Gas Pycnometry
Fast, precise measurements of true volume, density, and porosity.
Laser Diffraction Particle Size Analysis (LD-PSA)
Analyzes particle sizes by measuring light scattering.
Scanning Acoustic Microscopy (SAM)
Locates internal flaws like cracks, voids, and delamination.
X-ray Computed Tomography (Micro-CT)
Non-contact, non-destructive 2D/3D images at micron scale.
X-ray Reflectometry (XRR)
Optimized scans tailored to each sample for best measurements.
Zeta Potential
Electric potential at the slipping plane of the EDL.
4-Point Probe (4PP) Measurement
Measures sheet resistance and resistivity accurately.
Scanning Capacitance Microscopy (SCM)
Maps charge carrier polarity/distribution in semiconductors.
Surface Free Energy (SFE)
Quantitative insight into surface energy for adhesion and coatings.
Water Contact Angle
Quantitative insight into surface interactions affecting adhesion.
Modernizing Microscopy Methods: Capabilities and Applications of TEM/STEM Systems
Modern (scanning) transmission electron microscopy (S/TEM) tools, like the Talos F200X system at Covalent, are outfitted with technologies that…
Upgrading Metrology Services With Mountains™ 9: Improved Automation, Visualization, and Analysis
The best dataset in the world would be useless without the right tools for data processing, statistical analysis, and visualization.…
Covalent Announces Analytical Services Partnership With Toray Research Center, Inc.
October…
Covalent and Teledyne CETAC Technologies Announce New Partnership to Advance Research in Analytical Chemistry Applications and Instrumentation
(Scanning) Transmission Electron Microscopy (S/TEM) Using the Thermo Fisher Talos F200X
Learn about the fundamentals of S/TEM analysis with the Talos F200X: imaging modes and signals, detector setup, and principles of…
Electron and Ion Beam Imaging With DualBeam Focused Ion Beam Scanning Electron Microscopes
These videos are excerpted from the joint webinar hosted by Covalent and our partner, ThermoFisher Scientific.
Videos in the Library:
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Join a team that's shaping the future of material insights. At Covalent, you'll work with world-class scientists, cutting-edge technology, and global industry leaders, all while making a measurable impact.
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eBrief
With so many surface imaging techniques available, it can be a challenge to select the best method for your project. Each technique provides surface data…
Covalent expert team of S/TEM analysts assembled this eBrief to debunk 7 of the most common misunderstandings about modern S/TEM capabilities and applications. They break…
Application Note
To capture the moment when materials change, such as during melting, solidification or crystal phase change, by in-situ X-ray diffraction measurement, the acquisition time of…
Lithium ion secondary batteries are widely used in small portable devices such as mobile phones. Research and development of lithium ion batteries for use in…
Datasheet
This brochure/datasheet from Rigaku provides a high-level overview into the technology and capabilities of their SmartLab XRD system.
ABSTRACT Previously, it was typical to conduct crystal structure analysis using the single crystal method. However, analysis of crystal structure using the single crystal method…
