October 10, 2025
In this case study, Jessica Batterman, Failure Analysis Engineer at Covalent, investigates a client’s recurring issues with unexpected power cycling and intermittent connectivity in PCB components. This analysis uncovers surface voiding in PCB assemblies as the root cause. Using advanced microscopy and cross-sectional techniques, Jessica demonstrates how these microstructural defects led to compromised electrical performance. This case highlights the value of expert failure analysis in resolving complex reliability challenges in modern electronics.
