From Malfunction to Solution – Advanced Failure Analysis for Materials & Electronics

This webinar is planned to take you deep into today’s highest-quality Failure Analysis (FA) techniques for diagnosing difficult challenges in electronics and advanced technologies. You will discover how tailored analysis plans and latest methods can effectively address even the toughest-to-solve failures by revealing root cause sources.

Practical case studies showing the efficacy of this process are to be presented. How advanced methods of analysis can be applied to materials, parts, and assemblies so that more insights are achieved is to be showcased. Typical modes of failure, from PCB microcracking up to DC generator magnet failure and ceramic furnace tube fracture, will be discussed.

Regardless of whether you work in electronics manufacturing, materials development, quality assurance, or product reliability, this session will provide you with insights and techniques to analyze root cause and avoid future failure. You will also learn how Covalent implements integrated FA workflows to achieve fast, accurate, and actionable results.

Who Should Attend?

• Electronics manufacturing scientists and engineers.
• Battery engineers and energy storage specialists.
• Designers of semiconductor devices and packaging engineers.
• Reliability engineers in automotive and transportation industries.
• Professionals in quality assurance and product reliability.
• Everyone concerned with methods for diagnosing and preventing complex assembly failures.

What You’ll Learn:

From symptoms to solution. Learn about Covalent’s FA workflow: problem definition, identification of failure mechanisms, execution of appropriate analysis tools, and advancing toward root cause and corrective action.

Case stories in materials and devices. See how various failures are investigated and solved in studies on PCBs, DC generators, and ceramic furnace tubes.

Root cause analysis and corrective action. See how lab data correlates with real-world use conditions, validated with repeat testing, and translated into actionable recommendations for improvements.

Industry applications. Gain insights into FA practices for electronics, batteries, polymers, metals, semiconductors, and medical devices during the Q&A session.

About Failure Analysis

Failure analysis is the systematic examination of failed materials, parts, or devices, in order to identify the origin of the failure and preclude its repetition. The procedure is of great importance to industries like electronics, avionics, autos, and medical devices, where the issues of reliability and protection are vital.

Analysis usually involves the identification of:

• Failure mode, for example, fracture, corrosion, delamination, etc.
• The mode of failure can be fatigue, thermal stress, contamination, diffusion, or mechanical overload.
• The contributing factors: things like design flaws, material defects, process variability, or environmental conditions.

By applying advanced analysis techniques, engineers can detail failure surfaces, detect impurities, and follow failure paths. Interfacing these measurements to statistical reliability analysis, teams can not only observe where and why a component or system has come apart, but also apply correction actions to improve manufacturing processes, material selection, and long-term system performance.