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Failure Analysis

Root cause investigation of material, process, and device failures.

What Is Failure Analysis?

Dealing with failure analysis is like solving a puzzle. In actual service, when materials, parts, or components fail, the fundamental problem is not just identifying what happened but why it happened and how to avoid its recurrence.

At Covalent, our experts are skilled problem solvers. We combine scientific knowledge with the most advanced analytical tools to identify underlying causes such as cracking, corrosion, deterioration of coatings, or polymer degradation.

Our specialists not only detect failure. We convert troublesome results to proactive high-precision insights that maintain performance and flow down your line. From semiconductors and metals all the way through to ceramics and composites, the Covalent Failure Analysis Laboratory offers insights and solutions so you can innovate with confidence.

Failure analysis – close‑up of cracked metal surface on aircraft or industrial component being examined to identify root cause of structural damage

Why Failure Analysis Is Important

Every unresolved material failure poses system-wide risks, including warranty headaches, costly recalls, and potential safety incidents. To mitigate these risks, consult an expert at Covalent to integrate failure analysis and quality control into your product development lifecycle from the outset instead of waiting for failures to manifest in the field.

Our diverse failure analysis and quality control services will help you to:

  • Zero in on defects before they escalate.
  • Boost product reliability across life cycles.
  • Integrate engineering failure analysis into your QA workflows.
  • Ensure industry and regulatory compliance.

Partner with Covalent to safeguard your product integrity, so you can relax and focus on scaling what matters: reputation, performance, and bottom line.

When Do You Need Failure Analysis?

Timely intervention is the key to preventing repeated failures or damage. You should consider consulting our failure analysis lab when:

  • A material fails unexpectedly during operation.
  • Cracking, corrosion, or fatigue surfaces on your metals or polymers.
  • Significant performance drop under environmental or mechanical stress.
  • Defective material detected during internal QA or returned under warranty.

Whether it’s metal failure analysis or polymer-specific investigations, early diagnostics make all the difference.

Common Types of Failure Analysis

  • Mechanical and Fracture Analysis: Focuses on identifying cracking modes by examining fracture surfaces & deformation patterns. Techniques like SEM & profilometry are usually used for analysis.
  • Corrosion and Environmental Analysis: Evaluates how chemical or environmental exposure altered the material surface or microstructure. Investigations use microscopy & surface chemistry tools to understand degradation pathways.
  • Manufacturing Defect Analysis: Aims to locate inclusions, voids, porosity, or poor interfaces that originate from production processes. Cross-sectional imaging & compositional methods are used to trace the defect & understand its impact on performance.
  • Chemical and Molecular Degradation Analysis: Examines changes in molecular structure due to oxidation, hydrolysis, UV exposure, or reaction. Spectroscopic techniques such as FTIR, Raman, or XPS help determine the process.
  • Thermal and Processing Analysis: Evaluates how temperature cycles, overheating, or residual stress affect the material. Methods like DSC, TGA, XRD stress analysis, & microstructure imaging reveal thermal damage.
  • Electrical and Electronic Analysis: Focuses on identifying damage mechanisms such as ESD, electromigration, & dielectric breakdown by inspecting conductive paths & insulating layers. High-resolution imaging, FIB cross-sections, & electrical characterization help map the progression of electrically driven degradation.
  • Contamination Analysis: Identifies foreign particles, films, or unexpected elements that interfere with mechanical, electrical, or chemical performance. Surface & bulk techniques like EDS, XPS, FTIR, ICP-MS are used for investigation.

Factors Influencing Failure Analysis Frequency

It is important to know when to consult for a failure test to avoid downtime and ensure reliability.

Covalent can support your quality assurance programs by integrating our failure analysis laboratory data into your QA cycle to identify red flags early.

Best Practices for Effective Failure Analysis

  • Define the problem and understand the context through client discussion:
    • Background review: service conditions, design specs, and history of the issue.
    • Understand your process, capture failure timeline and symptoms.
    • Define and validate scope, urgency, and success criteria.
  • Hypothesize potential failure mechanisms and present an action plan.
  • Gather evidence:
    • Collect failed parts, reference samples, and related documentation.
    • Ensure proper chain of custody for sensitive or legal cases.
    • Document condition through photos, measurements, and baseline tests.
  • Collect data and perform additional analysis as needed:
    • Apply the most suitable analytical tools (SEM, EDS, FTIR, X-ray, etc.).
    • Simulate operating conditions if needed.
    • Compare with baseline or reference materials.
  • Comprehensively analyze all the information gathered:
    • Correlate lab data with real-world usage and known failure mechanisms.
    • Identify root caluse and contributing factors.
    • Validate through repeat testing or cross-method confirmation.
  • Report findings and validate the hypotheses.
  • Recommend Solutions/ Corrective actions.

Industries That Benefit From Failure Analysis

Covalent’s mission is to empower innovators across industries with precise, world-class insights that move science forward faster, affordably, and confidently. Our failure analysis services deliver engineering-grade solutions to support global clientele at the cutting-edge.

Aerospace

Aerospace and Defense

From fatigue and corrosion cracking in structural alloys to composite delamination and electronics or PCB failures under thermal cycling, Covalent’s failure analysis team delivers root cause clarity using targeted microscopy, cross sections, and electrical and chemical characterization.

Manufacturing and Industrial Automation

Manufacturing

Whether it is low yield, process excursions, contamination, or joint and interface defects, Covalent applies a structured failure analysis workflow from non destructive inspection through destructive cross sections and SEM EDS to isolate the defect, validate hypotheses, and drive corrective actions.

Semiconductors & Electronics

Semiconductor

From Interconnect wire pulls and delamination to dielectric breakdown, our failure analysis lab closes in on micro-voids, contaminant particles, and packaging flaws.

Medical Device

Medical Devices

Be it a catheter leak, implant surface pitting, or sterilization-driven polymer fractures, Covalent’s metallurgical failure analysis and mechanical failure analysis ensure patient safety and regulatory compliance.

Energy & Batteries

Energy

We diagnose stress-rupture culprits and corrosion pathways like a pro, so energy professionals can keep those turbines spinning and pipelines flowing.

Electronics

Consumer Electronics

Battery short circuits? Solder-joint fractures or plastic housing cracks? Our X-ray imaging, XPS, and SEM/EDS expertise will unearth the root cause before the recall bites.

Why Choose Covalent for Failure Analysis?

Covalent has a proven track record of trust and success with scientists and engineers at many of the world’s most influential companies. We help them understand the optical, chemical, physical, and electrical properties of advanced materials and devices.

Our Silicon Valley lab was built to pinpoint failure modes across metals, polymers, ceramics, and complex assemblies. It is staffed with a team of industry-best, highly experienced materials scientists and engineers, and equipped with state-of-the-art instrumentation. We don’t just analyze; we interpret, explain, and solve with precision.

What our clients get is fast, focused, field-ready analysis, designed for action. Clear, conclusive, and built to move you forward with confidence.

Frequently Asked Questions

Commonly Used Techniques for Failure Analysis

  • Electrical characterization.
  • Fault isolation.
  • Nano probing.
  • Optical Microscopy and Profilometry (VR, VK, WLI).
  • X-ray Inspection (2D, Micro-CT).
  • Scanning Acoustic Microscopy (SAM).
  • Scanning Electron Microscopy with Energy Dispersive X-ray Spectroscopy (SEM-EDS).
  • Focused Ion Beam and Transmission Electron Microscopy (FIB, TEM).
  • Cross-Section Analysis (Mechanical, Cryo Broad Ion Beam).
  • Fractographic Inspection.
  • Corrosion Analysis (SEM-EDS, XPS, LECO, ICP, GD)

2D X-Ray Inspection

Delivers clear internal views of complex electronics. Explore

Mechanical Cross-Section Analysis (X-Section)

Uncovers microstructures and defects causing performance issues. Explore

Scanning Acoustic Microscopy (SAM)

Locates internal flaws like cracks, voids, and delamination. Explore

Scanning Electron Microscopy (SEM)

Images surface topography and composition with electrons. Explore

Transmission Electron Microscopy (TEM)

Images atomic structure, defects, interfaces with sub-nm resolution. Explore

White Light Interferometry (WLI)

Measures surface topography with sub-nanometer vertical resolution. Explore

X-ray Computed Tomography (Micro-CT)

Non-contact, non-destructive 2D/3D images at micron scale. Explore

X-ray Photoelectron Spectroscopy (XPS)

Measures surface elemental composition and chemical states. Explore

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