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Application Note

Thermal Solutions: Characterization of Epoxy Reinforced Glass by DSC and DMA
Jun 12, 2021

Thermal Solutions: Characterization of Epoxy Reinforced Glass by DSC and DMA

Differential Scanning Calorimetry (DSC) measures the temperatures and heat flows associated with transitions in materials as a function of temperature or time in a controlled…

Application Note

Thermal Solutions: Characterization of Polyurethane by TGA and Hi-Res TGA
Jun 12, 2021

Thermal Solutions: Characterization of Polyurethane by TGA and Hi-Res TGA

Thermogravimetric Analysis (TGA) measures the amount and rate of change in sample weight as a function of temperature or time. TGA experiments use linear heating…

Application Note

Thermal Analysis Application Brief Determination of Polymer Crystallinity by DSC
Jun 12, 2021

Thermal Analysis Application Brief Determination of Polymer Crystallinity by DSC

SummaryPerhaps no fundamental property affects the physical properties of a polymer in so general a way as the degree of crystallinity. Differential scanning calorimetry (DSC)…

Application Note

TGA-IR Analysis Using the OMNIC Mercury TGA Software
Jun 12, 2021

TGA-IR Analysis Using the OMNIC Mercury TGA Software

Procedures like failure analysis, process validation and competitive investigations often require that a sample be deformulated to identify components and to understand processing differences. TGA-IR…

eBrief

Contamination Identification
Jun 12, 2021

Contamination Identification

This eBrief describes how to strategize a metrology regimen to identify the species and source of contamination when it occurs in materials.

eBook

Printed Circuit Board Assembly (PCBA) Characterization by Destructive Physical Analysis (DPA)
Jun 08, 2021

Printed Circuit Board Assembly (PCBA) Characterization by Destructive Physical Analysis (DPA)

The best-known method to test the quality of printed circuit boards and their components is Destructive Physical Analysis (DPA). This process yields a comprehensive quality…

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