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    Techniques
      • Electron Microscopy
        Electron Microscopy

        Atomic Resolution Electron Microscopy (AEM)

        Images atoms and maps composition, bonding, and strain.

        Differential Phase Contrast

        Visualize local electric fields at the nanoscale.

        Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)

        Combines ion milling and electron imaging for nanoscale analysis.

        Precession Electron Diffraction (PED)

        PED is a TEM-based technique that rotates the electron beam for more precise crystallography at the nanoscale.

        Scanning Electron Microscopy (SEM)

        Images surface topography and composition with electrons.

        Scanning Transmission Electron Microscopy (STEM)

        Provides atomic-scale imaging and spectroscopic mapping.

        Transmission Electron Microscopy (TEM)

        Images atomic structure, defects, interfaces with sub-nm resolution.

      • Chemical Analysis
        Chemical analysis

        Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)

        Rapid, non-destructive chemical identification.

        Auger Electron Spectroscopy (AES)

        Measures Auger electrons for high-resolution surface analysis.

        Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)

        Quantifies elements and isotopes with nanometer depth profiling.

        Electron Probe Microanalysis (EPMA)

        Quantifies elemental composition at the micron scale.

        Energy Dispersive X-ray Fluorescence (EDXRF)

        Quick, non-destructive material composition & thickness analysis.

        Fourier Transform Infrared Spectroscopy (FTIR)

        Rapid, non-destructive molecular fingerprinting across materials.

        Gas Chromatography-Mass Spectrometry (GC-MS)

        Identifies and quantifies small organic molecules in mixtures.

        Gel Permeation Chromatography (GPC)

        Separates molecules by size to determine polymer properties.

        Glow Discharge Optical Emission Spectroscopy (GDOES)

        Sputters surfaces to quantify composition & depth-profile layers.

        Inductively Coupled Plasma Mass Spectrometry (ICP-MS)

        Measures trace elements with high accuracy.

        Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)

        Quantifies multiple elements at very low concentrations.

        Ion Scattering Spectroscopy (ISS)

        Identifies elements in the outermost atomic layer.

        Nanoscale Secondary Ion Mass Spectrometry (NanoSIMS)

        Ultra-high-resolution elemental and isotopic imaging.

        Neutron Activation Analysis (NAA)

        Quantifies elements via gamma rays from irradiated samples.

        Nuclear Magnetic Resonance Spectroscopy (NMR)

        Determines molecular structure, composition, and dynamics.

        Photo-induced Force Microscopy (PiFM)

        Nanoscale chemical characterization & topography at sub-5nm.

        Raman Spectroscopy

        Measures inelastic photon scattering for chemical identification.

        Rutherford Backscattering Spectroscopy (RBS)

        Quantifies elemental composition and thin-film thickness.

        Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS)

        Ultra-sensitive surface analysis with chemical imaging & depth profiling.

        Total Reflection X-ray Fluorescence (TXRF)

        TXRF is a surface sensitive elemental analysis technique used to determine the concentration of trace metal contamination on wafer surfaces.

        Ultraviolet Photoelectron Spectroscopy (UPS)

        Determines work function and valence electronic structure of surfaces.

        Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)

        Measures absorbance, reflectance, and transmittance (175–3300 nm).

        Wavelength Dispersive X‑Ray Fluorescence (WDXRF)

        Non-destructive elemental composition & thin-film analysis.

        White Light Interferometry (WLI)

        Measures surface topography with sub-nanometer vertical resolution.

        X-ray Absorption Spectroscopy (XAS)

        Analyzes electronic structure of atoms and molecules.

        X-ray Diffraction (XRD)

        Non-destructive analysis of crystal phases, lattice, and strain.

        X-ray Photoelectron Spectroscopy (XPS)

        Measures surface elemental composition and chemical states.

      • Optical Analysis
        Optical analysis

        Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)

        Rapid, non-destructive chemical identification.

        Cathodoluminescence (CL)

        Maps bandgap, defects, and strain with SEM correlation.

        Digital Optical Microscopy

        Rapid, high-resolution imaging of a sample.

        Dynamic Light Scattering (DLS)

        Quantifies particle size and uniformity in minutes.

        Electron Probe Microanalysis (EPMA)

        Quantifies elemental composition at the micron scale.

        Energy Dispersive X-ray Fluorescence (EDXRF)

        Quick, non-destructive material composition & thickness analysis.

        Fourier Transform Infrared Spectroscopy (FTIR)

        Rapid, non-destructive molecular fingerprinting across materials.

        Infra-Red (IR) Thermography

        Visualizes surface temperatures to reveal defects & hotspots.

        Laser Scanning Confocal Microscopy (LSCM)

        Non-destructive 3D imaging of sample surfaces.

        Photo-induced Force Microscopy (PiFM)

        Nanoscale chemical characterization & topography at sub-5nm.

        Raman Spectroscopy

        Measures inelastic photon scattering for chemical identification.

        SNOM-Raman

        Maps nanoscale stress and chemistry with 100 nm resolution.

        Spectroscopic Ellipsometry (SE)

        Measures thin-film thickness & optical properties.

        Structured Light Profilometry

        Creates precise 3D models without contact or damage.

        Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)

        Measures absorbance, reflectance, and transmittance (175–3300 nm).

        X-ray Absorption Spectroscopy (XAS)

        Analyzes electronic structure of atoms and molecules.

      • Mechanical Testing
        Mechanical Testing

        Capillary Flow Porometry (CFP)

        Characterizes through-pores in wettable, permeable materials.

        Dye & Pry Testing

        Reveals PCB solder joint cracks & defects.

        Dynamic Mechanical Analysis (DMA)

        Characterizes thermal and mechanical properties of soft materials.

        IPC Compliance Testing (IPC Compliance)

        Verifies IPC-A-610 quality to reduce defects.

        Mechanical Cross-Section Analysis (X-Section)

        Uncovers microstructures and defects causing performance issues.

        Nano-Scratch Test

        Measures lateral/frictional force between tip & sample.

        Nanoindentation

        Determines mechanical properties including hardness & modulus.

        Pendant Drop Surface Tension Measurement

        Provides accurate liquid property analysis for surface tension.

        Rheology

        Evaluates material behavior during processing, storage, and use.

        Tap Density Analysis

        Ratio of sample mass to volume after mechanical tapping.

        Tensile Testing

        Measures material behavior under axial stretching (tension).

        Thermomechanical Analysis (TMA)

        Measures material dimension changes with temp, time, or force.

      • Thermal Analysis
        Thermal Analysis

        Differential Scanning Calorimetry (DSC)

        Quantifies heat flow for material optimization.

        Dynamic Mechanical Analysis (DMA)

        Characterizes thermal and mechanical properties of soft materials.

        Infra-Red (IR) Thermography

        Visualizes surface temperatures to reveal defects & hotspots.

        Thermogravimetric Analysis (TGA)

        Measures material mass changes with temperature or time.

        Thermomechanical Analysis (TMA)

        Measures material dimension changes with temp, time, or force.

      • Morphology & Structural Analysis
        Morphology & Structural Analysis

        2D X-Ray Inspection

        Delivers clear internal views of complex electronics.

        Atomic Force Microscopy (AFM)

        Maps nanoscale topography and material properties with a sharp probe.

        Chromatic Confocal Profilometry & 3D Surface Profiling

        Fast, non-contact 3D surface measurements.

        Dynamic Light Scattering (DLS)

        Quantifies particle size and uniformity in minutes.

        Gas Adsorption Porosimetry

        Characterizes porous materials.

        Gas Pycnometry

        Fast, precise measurements of true volume, density, and porosity.

        Laser Diffraction Particle Size Analysis (LD-PSA)

        Analyzes particle sizes by measuring light scattering.

        Photo-induced Force Microscopy (PiFM)

        Nanoscale chemical characterization & topography at sub-5nm.

        Scanning Acoustic Microscopy (SAM)

        Locates internal flaws like cracks, voids, and delamination.

        Structured Light Profilometry

        Creates precise 3D models without contact or damage.

        X-ray Computed Tomography (Micro-CT)

        Non-contact, non-destructive 2D/3D images at micron scale.

        X-ray Diffraction (XRD)

        Non-destructive analysis of crystal phases, lattice, and strain.

        X-ray Reflectometry (XRR)

        Optimized scans tailored to each sample for best measurements.

        Zeta Potential

        Electric potential at the slipping plane of the EDL.

      • More Techniques
        More Techniques

        4-Point Probe (4PP) Measurement

        Measures sheet resistance and resistivity accurately.

        Scanning Capacitance Microscopy (SCM)

        Maps charge carrier polarity/distribution in semiconductors.

        Surface Free Energy (SFE)

        Quantitative insight into surface energy for adhesion and coatings.

        Water Contact Angle

        Quantitative insight into surface interactions affecting adhesion.

      • Explore All Techniques
    • Resources
      Resources
      • Webinars
        Webinars
        covalent-academy-episode-37-banner-FINAL_Academy-Zoom-scaled

        Battery Material Quality: The Importance of Physical Properties

        Join this webinar to learn what underlying physical properties of battery materials inform the stability and performance of assembled cells,…

        Watch Now
        VF JuneBatteryForum

        Volta Foundation: June Battery Forum

        Covalent offers end-to-end testing of battery materials and assembled cells, and we'll be walking audiences through a robust suite of…

        Watch Now
      • Blogs
        Blogs
        7 Tips for Improving Your “Buy vs. Build” Analysis

        7 Tips for Improving Your “Buy vs. Build” Analysis

        How should you think through the decision of whether to outsource analysis vs. purchase, install, maintain, and support a new…
        Explore
        Strategic Outsourcing of Metrology and Characterization

        Strategic Outsourcing of Metrology and Characterization

        My job provides ample opportunity to speak with engineers, managers, and company leaders about their imaging, measurement, and characterization needs.…
        Explore
      • News
        News

        Expanded Analytical Chemistry Lab at Covalent Provides Comprehensive Testing for Solids and Liquids

        A new ICP-OES and microwave digestor at Covalent round out its chemistry laboratory to deliver complete, modern chemical analysis…

        Explore

        Covalent Offers Fast, High-Res Surface Imaging for Full Wafers With CT300 System

        The new, high-resolution profilometer at Covalent enables non-destructive, high-speed imaging analysis on larger and more intricate samples than ever…

        Explore
      • Library
        Library
        Catalyst Characterization: A Metrology-Driven Approach

        Catalyst Characterization: A Metrology-Driven Approach

        These excerpts of Covalent Academy's webinar on porous materials characterization introduce 3 of the most common techniques in this field.

        Explore
        PCB Failure Analysis: Investigating Defects and Anomalies in Solder Joints

        PCB Failure Analysis: Investigating Defects and Anomalies in Solder Joints

        These excerpts of Covalent Academy's webinar on porous materials characterization introduce 3 of the most common techniques in this field.

        Explore
    • Company
      Company
      • About Us
        About Us
        About

        Covalent transforms complex material testing data into clear, actionable insights. From failure analysis to advanced compositional studies, we partner with innovators across industries to accelerate development and optimize performance.

        Learn more
      • Team
        Team

        We’re scientists, engineers, and problem-solvers first. Over 70% of us hold PhDs or advanced degrees. Every engagement is led by credentialed experts who combine deep technical knowledge with practical solutions tailored to your toughest challenges.

        Meet the team
      • Partners
        Partners

        Trusted by 1,500+ global manufacturers, OEMs, and R&D teams, Covalent builds long-term partnerships that deliver results at scale. Backed by $25M in tools and ISO-accredited methods, we focus on just one thing: data you can act on with confidence.

        Explore our partnerships
      • Careers
        Careers

        Join a team that's shaping the future of material insights. At Covalent, you'll work with world-class scientists, cutting-edge technology, and global industry leaders, all while making a measurable impact.

        View careers
      • Accreditations & Quality
        Accreditations & Quality

        Quality is foundational to our work. Covalent is ISO accredited and operates under a rigorous quality management system. Our processes, data, and results meet internationally recognized standards so you can trust every measurement and insight we deliver.

        Learn more
    • Nexus Membership
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    Home/Webinars

    Webinar

    Explore expert-led webinars on failure analysis, interfaces, thin films, and more. Learn how leading R&D teams use advanced analytical techniques to solve real-world engineering problems.

    Read time

    60 mins

    Ep18_Thermo_FIB-SEM
    Dec 10, 2020

    Expert Lessons in Electron and Ion Beam Imaging and Interpretation

    In this webinar recording, experts from Covalent Metrology and Thermo Fisher Scientific will discuss cutting-edge techniques and best practices for optimizing images captured with a FIB-SEM DualBeam microscope. Topics will include image interpretation, exploration of new state-of-the-art instrumentation, and the realm of analytical possibilities accessed using these techniques. This Webinar will Cover: DualBeam FIB-SEM: Combining…

    Read time

    60 mins

    Ep17_Work-Function-v4
    Oct 8, 2020

    Work Function: Bridging the Gap Between Theory and Reality

    Explore common misunderstandings about the work function of materials. This webinar recording dials in to the mainstream and modern techniques used to measure work function and sharing tactics to ensure you’re accessing the right information with these methods. Covalent speakers Roland Barbosa, PhD, and Chris Moore, PhD discuss both the theory and the practice behind…

    Read time

    60 mins

    Ep16_S-TEM-and-Talos
    Sep 3, 2020

    Scanning Transmission Electron Microscopy: Affordable Imaging and Analysis at Atomic Scale

    Take an expert deep-dive into one of the most exciting characterization techniques available: (Scanning) Transmission Electron Microscopy (S/TEM) – the highest-resolution imaging technique in the world today. S/TEM is able to capture spatial features on the scale of individual atoms, and to map the elemental composition and morphology of complex nanomaterials and devices. These kinds…

    Read time

    56 mins

    Ep15_SAM-with-PVA-TePla-Facebook
    Aug 20, 2020

    Seeing in Sound: Ultrasonic Imaging With Scanning Acoustic Microscopy

    In this video installment of Covalent Academy’s Advancements in Instrumentation webinar miniseries, we put a finger to the pulse of innovations in Scanning Acoustic Microscopy (SAM). Guest speaker Lisa Logan from PVA TePla, a global leader in manufacturing acoustic microscopy systems, will describe how acoustic microscopy generates high-resolution 2D and 3D images, and will probe a selection of…

    Read time

    60 mins

    Ep15_SAM-with-PVA-TePla-Facebook
    Aug 6, 2020

    Shining a Light on Optical Modeling for Spectral Ellipsometry

    Spectroscopic Ellipsometry is a powerful and highly sensitive metrology technique. However, unlocking its full potential requires more than collecting sound data. Nearly all results are only obtained after fitting optical models to the measurements; a sometimes-challenging process with significant repercussions for analytical accuracy. In this webinar recording, ellipsometry expert Dr. Max Junda, Senior Member of…

    Read time

    60 mins

    Ep12_XRR-v
    Jul 9, 2020

    (Thin Film) Reflections on X-Ray Reflectometry

    This webinar recording will help you strengthen your knowledge on one of the most useful non-destructive thin film characterization tools available: X-Ray Reflectometry (XRR). This technique provides highly accurate layer thickness measurement as well as electron density and interfacial roughness information on single and multilayer thin film materials. This information can be equally useful in…

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