Atomic Resolution Electron Microscopy (AEM)
Images atoms and maps composition, bonding, and strain.
Differential Phase Contrast
Visualize local electric fields at the nanoscale.
Focused Ion Beam Scanning Electron Microscopy (FIB-SEM)
Combines ion milling and electron imaging for nanoscale analysis.
Precession Electron Diffraction (PED)
PED is a TEM-based technique that rotates the electron beam for more precise crystallography at the nanoscale.
Scanning Electron Microscopy (SEM)
Images surface topography and composition with electrons.
Scanning Transmission Electron Microscopy (STEM)
Provides atomic-scale imaging and spectroscopic mapping.
Transmission Electron Microscopy (TEM)
Images atomic structure, defects, interfaces with sub-nm resolution.
Attenuated Total Reflectance Fourier Transform Infrared Spectroscopy (ATR-FTIR)
Rapid, non-destructive chemical identification.
Auger Electron Spectroscopy (AES)
Measures Auger electrons for high-resolution surface analysis.
Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)
Quantifies elements and isotopes with nanometer depth profiling.
Electron Probe Microanalysis (EPMA)
Quantifies elemental composition at the micron scale.
Energy Dispersive X-ray Fluorescence (EDXRF)
Quick, non-destructive material composition & thickness analysis.
Fourier Transform Infrared Spectroscopy (FTIR)
Rapid, non-destructive molecular fingerprinting across materials.
Gas Chromatography-Mass Spectrometry (GC-MS)
Identifies and quantifies small organic molecules in mixtures.
Gel Permeation Chromatography (GPC)
Separates molecules by size to determine polymer properties.
Glow Discharge Optical Emission Spectroscopy (GDOES)
Sputters surfaces to quantify composition & depth-profile layers.
Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
Measures trace elements with high accuracy.
Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
Quantifies multiple elements at very low concentrations.
Ion Scattering Spectroscopy (ISS)
Identifies elements in the outermost atomic layer.
Nanoscale Secondary Ion Mass Spectrometry (NanoSIMS)
Ultra-high-resolution elemental and isotopic imaging.
Neutron Activation Analysis (NAA)
Quantifies elements via gamma rays from irradiated samples.
Nuclear Magnetic Resonance Spectroscopy (NMR)
Determines molecular structure, composition, and dynamics.
Photo-induced Force Microscopy (PiFM)
Nanoscale chemical characterization & topography at sub-5nm.
Raman Spectroscopy
Measures inelastic photon scattering for chemical identification.
Rutherford Backscattering Spectroscopy (RBS)
Quantifies elemental composition and thin-film thickness.
Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS)
Ultra-sensitive surface analysis with chemical imaging & depth profiling.
Total Reflection X-ray Fluorescence (TXRF)
TXRF is a surface sensitive elemental analysis technique used to determine the concentration of trace metal contamination on wafer surfaces.
Ultraviolet Photoelectron Spectroscopy (UPS)
Determines work function and valence electronic structure of surfaces.
Ultraviolet Visible Near Infrared Spectrophotometry (UV-Vis-NIR)
Measures absorbance, reflectance, and transmittance (175–3300 nm).
Wavelength Dispersive X‑Ray Fluorescence (WDXRF)
Non-destructive elemental composition & thin-film analysis.
White Light Interferometry (WLI)
Measures surface topography with sub-nanometer vertical resolution.
X-ray Absorption Spectroscopy (XAS)
Analyzes electronic structure of atoms and molecules.
X-ray Diffraction (XRD)
Non-destructive analysis of crystal phases, lattice, and strain.
X-ray Photoelectron Spectroscopy (XPS)
Measures surface elemental composition and chemical states.
Cathodoluminescence (CL)
Maps bandgap, defects, and strain with SEM correlation.
Digital Optical Microscopy
Rapid, high-resolution imaging of a sample.
Dynamic Light Scattering (DLS)
Quantifies particle size and uniformity in minutes.
Infra-Red (IR) Thermography
Visualizes surface temperatures to reveal defects & hotspots.
Laser Scanning Confocal Microscopy (LSCM)
Non-destructive 3D imaging of sample surfaces.
SNOM-Raman
Maps nanoscale stress and chemistry with 100 nm resolution.
Spectroscopic Ellipsometry (SE)
Measures thin-film thickness & optical properties.
Structured Light Profilometry
Creates precise 3D models without contact or damage.
Capillary Flow Porometry (CFP)
Characterizes through-pores in wettable, permeable materials.
Dye & Pry Testing
Reveals PCB solder joint cracks & defects.
Dynamic Mechanical Analysis (DMA)
Characterizes thermal and mechanical properties of soft materials.
IPC Compliance Testing (IPC Compliance)
Verifies IPC-A-610 quality to reduce defects.
Mechanical Cross-Section Analysis (X-Section)
Uncovers microstructures and defects causing performance issues.
Nano-Scratch Test
Measures lateral/frictional force between tip & sample.
Nanoindentation
Determines mechanical properties including hardness & modulus.
Pendant Drop Surface Tension Measurement
Provides accurate liquid property analysis for surface tension.
Rheology
Evaluates material behavior during processing, storage, and use.
Tap Density Analysis
Ratio of sample mass to volume after mechanical tapping.
Tensile Testing
Measures material behavior under axial stretching (tension).
Thermomechanical Analysis (TMA)
Measures material dimension changes with temp, time, or force.
Differential Scanning Calorimetry (DSC)
Quantifies heat flow for material optimization.
Thermogravimetric Analysis (TGA)
Measures material mass changes with temperature or time.
2D X-Ray Inspection
Delivers clear internal views of complex electronics.
Atomic Force Microscopy (AFM)
Maps nanoscale topography and material properties with a sharp probe.
Chromatic Confocal Profilometry & 3D Surface Profiling
Fast, non-contact 3D surface measurements.
Gas Adsorption Porosimetry
Characterizes porous materials.
Gas Pycnometry
Fast, precise measurements of true volume, density, and porosity.
Laser Diffraction Particle Size Analysis (LD-PSA)
Analyzes particle sizes by measuring light scattering.
Scanning Acoustic Microscopy (SAM)
Locates internal flaws like cracks, voids, and delamination.
X-ray Computed Tomography (Micro-CT)
Non-contact, non-destructive 2D/3D images at micron scale.
X-ray Reflectometry (XRR)
Optimized scans tailored to each sample for best measurements.
Zeta Potential
Electric potential at the slipping plane of the EDL.
4-Point Probe (4PP) Measurement
Measures sheet resistance and resistivity accurately.
Scanning Capacitance Microscopy (SCM)
Maps charge carrier polarity/distribution in semiconductors.
Surface Free Energy (SFE)
Quantitative insight into surface energy for adhesion and coatings.
Water Contact Angle
Quantitative insight into surface interactions affecting adhesion.
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These excerpts of Covalent Academy's webinar on porous materials characterization introduce 3 of the most common techniques in this field.
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Covalent transforms complex material testing data into clear, actionable insights. From failure analysis to advanced compositional studies, we partner with innovators across industries to accelerate development and optimize performance.
We’re scientists, engineers, and problem-solvers first. Over 70% of us hold PhDs or advanced degrees. Every engagement is led by credentialed experts who combine deep technical knowledge with practical solutions tailored to your toughest challenges.
Trusted by 1,500+ global manufacturers, OEMs, and R&D teams, Covalent builds long-term partnerships that deliver results at scale. Backed by $25M in tools and ISO-accredited methods, we focus on just one thing: data you can act on with confidence.
Join a team that's shaping the future of material insights. At Covalent, you'll work with world-class scientists, cutting-edge technology, and global industry leaders, all while making a measurable impact.
Quality is foundational to our work. Covalent is ISO accredited and operates under a rigorous quality management system. Our processes, data, and results meet internationally recognized standards so you can trust every measurement and insight we deliver.
Explore expert-led webinars on failure analysis, interfaces, thin films, and more. Learn how leading R&D teams use advanced analytical techniques to solve real-world engineering problems.
60 mins
In this webinar recording, experts from Covalent Metrology and Thermo Fisher Scientific will discuss cutting-edge techniques and best practices for optimizing images captured with a FIB-SEM DualBeam microscope. Topics will include image interpretation, exploration of new state-of-the-art instrumentation, and the realm of analytical possibilities accessed using these techniques. This Webinar will Cover: DualBeam FIB-SEM: Combining…
Explore common misunderstandings about the work function of materials. This webinar recording dials in to the mainstream and modern techniques used to measure work function and sharing tactics to ensure you’re accessing the right information with these methods. Covalent speakers Roland Barbosa, PhD, and Chris Moore, PhD discuss both the theory and the practice behind…
Take an expert deep-dive into one of the most exciting characterization techniques available: (Scanning) Transmission Electron Microscopy (S/TEM) – the highest-resolution imaging technique in the world today. S/TEM is able to capture spatial features on the scale of individual atoms, and to map the elemental composition and morphology of complex nanomaterials and devices. These kinds…
56 mins
In this video installment of Covalent Academy’s Advancements in Instrumentation webinar miniseries, we put a finger to the pulse of innovations in Scanning Acoustic Microscopy (SAM). Guest speaker Lisa Logan from PVA TePla, a global leader in manufacturing acoustic microscopy systems, will describe how acoustic microscopy generates high-resolution 2D and 3D images, and will probe a selection of…
Spectroscopic Ellipsometry is a powerful and highly sensitive metrology technique. However, unlocking its full potential requires more than collecting sound data. Nearly all results are only obtained after fitting optical models to the measurements; a sometimes-challenging process with significant repercussions for analytical accuracy. In this webinar recording, ellipsometry expert Dr. Max Junda, Senior Member of…
This webinar recording will help you strengthen your knowledge on one of the most useful non-destructive thin film characterization tools available: X-Ray Reflectometry (XRR). This technique provides highly accurate layer thickness measurement as well as electron density and interfacial roughness information on single and multilayer thin film materials. This information can be equally useful in…